Semiconductor Laser Plated Metal Layer Heat Sinkability
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Solution Overview
Problem
High-power semiconductor lasers experience catastrophic optical damage (COD) due to temperature increases at the light-emitting end face, which is exacerbated by poor heat sinkability, leading to inefficient heat transfer and potential laser light interference.
Innovation Solution
A semiconductor laser design featuring a plated metal layer with a thicker front end portion than central portion, allowing for efficient heat transfer to a heat sink even when the light-emitting end face is projected, and incorporating a step gap surface for enhanced thermal contact, thereby improving heat sinkability and preventing COD.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light-emitting end face is projected from the heat sink to prevent laser light interference, then laser light emission is improved, but heat sinkability deteriorates
Solution Approach 1:
The plated metal layer is designed with a stepped structure having different thicknesses in different regions (thinner at the light-emitting end face, thicker at the rear end face). This dimensional variation allows the light-emitting end face to be projected from the heat sink while the thicker rear portion maintains efficient thermal contact, resolving the contradiction between light emission and heat sinking.
2Ease of manufacture
If the plated metal layer has uniform thickness, then manufacturing is simplified, but heat transfer efficiency deteriorates
Solution Approach 1:
The plated metal layer is designed with non-uniform thickness, being thinner at the light-emitting end face and thicker at the rear end face. This local quality variation optimizes heat transfer efficiency by providing greater thermal mass and contact area at the heat sink interface, while maintaining manufacturability through controlled plating processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses temperature increases at the light-emitting end face, preventing COD and enabling high-power operation while ensuring accurate Auto Power Control and preventing laser light interference with the heat sink.
Implementation Method 1
heat generated in vicinities of the light-emitting end face 550a of the main body 550 cannot efficiently be transferred to the submount 601
Data Source
AI summary
A semiconductor laser improved in heat sinkability of portions in the vicinity of a light-emitting end face of a main body in order to prevent occurrence of COD is provided. A main body 150 having a light-emitting end face 150a for emitting laser light is formed on a semiconductor substrate, n-type GaAs substrate. Thickness of a front end portion 112a in the vicinity of the light-emitting end face 150a of a plated metal layer 112 formed on the main body 150 is larger than thickness of a central portion 112b of the plated metal layer 112 in a direction along a cavity.