Drive Chip Terminal Arrangement for Slim Display Bonding
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Solution Overview
Problem
Conventional drive chips face challenges in securing sufficient area for circuitry while preventing sagging during compression bonding, leading to defective electrical connections in slim liquid crystal display devices.
Innovation Solution
A drive chip design featuring two groups of terminals with a narrow-pitch and rough-pitch arrangement, along with a dummy bump in the rough-pitch portion, which suppresses sagging and maintains parallel alignment with the liquid crystal panel during bonding, allowing for adequate circuitry area without increasing the chip's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If dummy terminals are arranged in one or more rows along the longer sides of the drive chip, then the area for circuitry is insufficient, but the chip size cannot be increased
Solution Approach 1:
The patent changes the arrangement pattern of terminals from a conventional single-row linear arrangement to a staggered multi-row arrangement. This dimensional reorganization of terminal positions creates additional space in the lengthwise direction, providing sufficient area for circuitry without increasing the overall chip size.
Solution Approach 2:
The patent introduces a dummy bump with specific properties (larger area than actual bumps, positioned in rough-pitch portion) that serves a localized function of suppressing sag. This local structural modification addresses the sagging problem without requiring global changes to the chip dimensions or overall terminal arrangement.
2Volume of moving object
If the drive chip is made slim, then the chip size is reduced, but the chip sags under heat during compression bonding causing defective electrical connection
Solution Approach 1:
The dummy bump is positioned in advance in the rough-pitch portion between terminal groups to counteract the sagging effect before compression bonding occurs. This preliminary structural support prevents the chip from sagging under heat during the bonding process, ensuring reliable electrical connection despite the slim chip profile.
Solution Approach 2:
The patent modifies the physical structure by adding a dummy bump with specific parameters (larger area than functional bumps, positioned in rough-pitch portion) that changes the mechanical behavior of the chip during bonding. This parameter change provides the necessary support to prevent sagging while maintaining the slim overall chip dimensions.
3Length of stationary object
If terminals are arranged at narrow pitch, then the chip size is reduced, but the area for circuitry becomes insufficient
Solution Approach 1:
The patent segments the terminal arrangement into different pitch regions: narrow-pitch portions for compactness and rough-pitch portions for providing circuitry space. This segmentation allows the chip to maintain a compact overall length while creating localized areas with sufficient space for circuitry and dummy bumps.
Solution Approach 2:
The patent transitions from a uniform single-row terminal arrangement to a staggered multi-row arrangement with varying pitch. This dimensional change in terminal positioning creates rough-pitch portions that provide adequate area for circuitry without increasing the chip's overall length.
Data Source
AI summary
This drive chip has a configuration that is provided with: a base main body; two terminal groups that are respectively disposed along the base main body sides in the longitudinal direction of the base main body, said sides facing each other; a narrow-pitch section in one terminal group wherein terminals are disposed in a zigzag manner in two or more rows, said narrow-pitch section having a narrow terminal pitch in the longitudinal direction; a rough pitch section in the one terminal group, said rough pitch section having a terminal pitch in the longitudinal direction wider than that of the narrow pitch section; and a dummy bump that is disposed between the two terminal groups, said dummy bump being disposed parallel to the rough pitch section.