Semiconductor Package Heat Sink Frame Lead Frame Design
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Solution Overview
Problem
Existing semiconductor lead frames face inefficiencies in heat dissipation due to excessive leads and inaccurate combinations with heat sinks, leading to slow heat dissipation and limited thermal conductivity, which can cause chip overheating.
Innovation Solution
A semiconductor package structure incorporating a heat sink frame connected to a heat sink via bonding material, with a lead frame design featuring first, second, and third leads for improved thermal management, along with a forming method that includes welding, injection-molding, and plating to enhance heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If excessive leads are used in the lead frame, then electrical connectivity is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The invention divides the lead frame into functionally distinct segments: a heat dissipation region with optimized lead arrangement for thermal management, and an electrical connection region with adequate leads for connectivity. This segmentation allows each region to optimize its specific function without compromising the other.
Solution Approach 2:
The patent applies different lead densities and configurations to different regions of the lead frame. The heat dissipation region uses a sparser lead arrangement to facilitate thermal conduction, while the electrical connection region maintains sufficient lead density for reliable connectivity, achieving local optimization of both functions.
2Ease of manufacture
If traditional heat sink combination methods are used, then manufacturing simplicity is maintained, but combination accuracy and heat dissipation efficiency deteriorate
Solution Approach 1:
The heat sink is pre-integrated with the lead frame during the lead frame manufacturing process itself, rather than being attached separately later. This preliminary action ensures precise alignment and combination accuracy while maintaining manufacturing efficiency through a unified production process.
Solution Approach 2:
The invention merges the heat sink and lead frame into a single integrated component structure. The heat sink is formed as an integral part of the lead frame, eliminating separate attachment steps and ensuring precise geometric alignment between the two functions while simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces wire count, improves heat dissipation by allowing heat transfer on both surfaces, ensures accurate frame alignment, and enhances reliability through solder wicking holes and connection rods, effectively addressing the limitations of existing technologies.
Implementation Method 1
the heat sink is connected to the chip through a bonding material
Implementation Method 2
the lead frame...to emit the heat produced during the operation of the chip
Data Source
AI summary
A semiconductor package structure and forming method thereof; the semiconductor package structure includes a heat sink frame (2) and a lead frame (1), where the heat sink frame (2) is connected with a heat sink (4), a chip pad (21) of the lead frame (1) is adhered with a chip (3), and the heat sink (4) is connected to the chip (3) through a bonding material (5), and where the lead frame (1) is provided with a first lead (22), and the heat sink frame (2) is provided with a second lead (43) and a third lead (44). The method of forming the semiconductor package structure comprises: arranging the second lead (43) and the third lead (44) on the heat sink (4), and connecting the first lead (22) to the bottom electrode of the chip pad (21) to form a current input terminal; connecting three second lead (43) on the heat sink frame (2) to the top electrode of the chip (3) to form a current output terminal; welding the third lead (44) on the heat sink frame (2) with a conductive wire to form a current control terminal, thus greatly reducing the use of conductive wires, and thus heat loss; and after injection molding, colloids are exposed on of both sides of the semiconductor package structure, thus realizing double-sided heat dissipation, and improving heat dissipation of the semiconductor package structure.