Electronic Device Wiring Pattern Opening Bonding
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Solution Overview
Problem
Conventional semiconductor light emitting devices face issues with the bonding layer peeling from the wiring pattern or base, leading to potential failures under thermal stress or moisture exposure.
Innovation Solution
An electronic device design featuring a wiring pattern with an opening, where the bonding layer is in contact with the base exposed through this opening, enhancing the bonding strength between the bonding layer and the base, thereby preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding layer is formed only on the wiring pattern, then the manufacturing process is simple, but the bonding layer peels from the wiring pattern or base under thermal stress or moisture exposure
Solution Approach 1:
The bonding layer is segmented into two distinct regions: a first bonding layer formed on the wiring pattern and a second bonding layer formed on the base through the opening. This segmentation allows each bonding layer to be optimized for its specific substrate, preventing peeling by ensuring adequate adhesion to both the wiring pattern and the base separately.
Solution Approach 2:
Different bonding layers are applied to different locations with different requirements. The first bonding layer contacts the wiring pattern while the second bonding layer contacts the base through the opening. This local differentiation ensures that each bonding interface has the appropriate bonding characteristics for its specific substrate, resolving the peeling issue without requiring a completely complex redesign.
2Reliability
If an opening is formed in the wiring pattern and bonding layer contacts the base, then peeling is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The opening is formed in the wiring pattern before the bonding layers are applied. This preliminary action allows the second bonding layer to be formed directly on the base surface in the opening region, ensuring proper adhesion to the base before any peeling can occur. The sequence of operations is planned in advance to simplify the overall manufacturing process despite the added complexity of the opening structure.
Data Source
AI summary
An electronic device includes: a base; a wiring pattern formed on the base; an electronic element disposed on the wiring pattern; and a bonding layer interposed between the electronic element and the wiring pattern, wherein an opening is formed in the wiring pattern and the bonding layer is in contact with a portion of the base exposed by the opening in the wiring pattern.