Padless Lead Frame IC Package with Nested Molding

The patent implements nested encapsulation by placing a first molded integrated circuit die within a second molding compound. The first molding compound encapsulates the die and provides initial protection, while the second molding compound provides an additional encapsulation layer. This nested structure allows multiple functions to be integrated within a compact volume by efficiently utilizing internal space.

The patent transitions from planar package layouts to a three-dimensional stacked architecture. By stacking integrated circuit dies vertically and encapsulating them in multiple molding layers, the design achieves higher functional integration without proportionally increasing the package footprint, effectively utilizing the vertical dimension to reduce overall package dimensions.

The manufacturing process is segmented into distinct stages: first encapsulation of the integrated circuit die in a first molding compound, followed by second encapsulation in a second molding compound. This segmentation allows each encapsulation step to be optimized independently, enabling cost-effective production using existing manufacturing processes while achieving reduced package dimensions through the cumulative effect of multiple encapsulation layers.

The first molding compound provides preliminary encapsulation and protection to the integrated circuit die before the second encapsulation step. This preliminary action ensures the die is securely protected and positioned during subsequent manufacturing steps, enabling efficient production while achieving compact final package dimensions through the combined effect of both encapsulation layers.

The patent employs composite encapsulation using two different molding compounds with complementary properties. The first molding compound provides baseline protection against environmental factors, while the second molding compound adds enhanced protection capabilities. This composite structure achieves superior environmental protection against humidity and contaminants while maintaining reduced package height, as the protective function is distributed across multiple thin layers rather than requiring a single thick layer.

The dual encapsulation structure provides beforehand cushioning against environmental harm. The first molding compound establishes the first line of defense against moisture and contaminants, while the second molding compound provides an additional protective barrier. This layered protection approach ensures robust environmental resistance even when the overall package height is minimized, as each layer contributes to the cumulative protective effect.