Memory Card Molded Encapsulant Inlet Design
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Solution Overview
Problem
The manufacturing process for complex-shaped memory cards is inefficient and costly due to the need for time-consuming three-dimensional cutting methods like water-jet machines or grinders, and conventional encapsulating molding leaves noticeable trace marks on the surface, which are problematic for small form factor cards.
Innovation Solution
A shape-molding structure where the encapsulant is formed using a mold with inlets on the side surfaces of the circuit substrate, allowing for the encapsulant to be injected and hardened, and then the trace marks from these inlets are cut off, resulting in a smooth outer surface, using a standard router or punch for singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional encapsulating molding with top inlet is used, then the molding process is simple, but trace marks remain on the outer surface causing appearance flaws
Solution Approach 1:
The patent moves the encapsulant inlet from the top surface (2D plane) to the side surface (3D different dimension) of the mold. This dimensional change allows the inlet to be positioned on the edge of the memory card where trace marks can be removed without affecting the main outer surface appearance, thus resolving the contradiction between manufacturing simplicity and surface quality.
2Manufacturing precision
If complex shape cutting is performed after molding, then the memory card achieves precise complex geometry, but the cutting process becomes time-consuming and costly
Solution Approach 1:
The patent performs the complex shape molding during the encapsulating molding process itself, before the cutting stage. The mold includes shape-molding structures that form the complex geometry (such as rounded corners and chamfers) directly in the encapsulant. This preliminary action eliminates the need for time-consuming post-molding cutting operations while maintaining precise complex geometry.
Solution Approach 2:
The patent combines the encapsulating molding function with the shape-forming function into a single integrated process. The mold structure includes both encapsulant injection capabilities and shape-molding structures, merging two separate operations (molding + complex shape cutting) into one simultaneous process, thereby improving productivity without sacrificing manufacturing precision.
3Ease of manufacture
If standard router or punch is used for singulation, then the equipment cost is reduced, but the ability to handle complex shapes is limited
Solution Approach 1:
The patent prepares the complex shapes in advance during the encapsulating molding process using integrated shape-molding structures. By the time singulation occurs, the memory cards already have their final complex geometries formed, allowing standard routers or punches to simply detach them without needing complex shape-cutting capabilities. This resolves the contradiction by shifting the complexity handling to an earlier stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces costs, and ensures a smooth, intact outer appearance for memory cards, even for complex shapes like miniSD and microSD cards, by using a standard router or punch for singulation and eliminating trace marks from the encapsulant inlet.
Implementation Method 1
encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate... the encapsulant to be injected and hardened
Data Source
AI summary
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.