Thermal Module Mounting Structure with Elastic Fastening

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Solution Overview

Problem

Conventional thermal module designs for computer on modules (COMs) face challenges with high thermal resistance due to the use of thermal pads, which lack elastic structures to absorb vibrations and overpressure, leading to potential chip damage and inefficient heat dissipation.

Innovation Solution

A thermal module mounting structure featuring first and second brackets with mounting and through holes, elastic fastening devices, and a screw mount with thermal paste or phase change material to secure the circuit board to the thermal module in a vertically floatable manner, ensuring close contact and flexibility to absorb vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a thermal pad is used as thermal interface material, then assembly tolerance absorption is improved, but thermal resistance increases

Engineering Contradiction:

Improveassembly tolerance absorptionVSAvoidthermal resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent changes the material parameter from traditional thermal pad to an elastic structure with embedded phase change material, transforming the thermal interface from a compromise between tolerance absorption and thermal conductivity to a solution that achieves both through phase transition mechanics

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent utilizes phase change material that transitions between solid and liquid states to simultaneously achieve stress buffering during assembly and optimal thermal contact during operation, resolving the contradiction between mechanical tolerance absorption and thermal conductivity

Inventive Principle:

Principle #36Phase transitions

2Stability of the object's composition

If a rigid locking method is used to fix the thermal module, then structural stability is improved, but vibration damage risk increases

Engineering Contradiction:

Improvestructural stabilityVSAvoidvibration damage

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent incorporates elastic structures and phase change materials in advance to provide cushioning against vibrations and overpressure before they occur, protecting the chip from damage while maintaining structural stability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent uses a composite structure combining elastic materials with phase change material to achieve both mechanical flexibility for vibration absorption and thermal conductivity for heat dissipation, resolving the contradiction between stability and vibration resistance

Inventive Principle:

Principle #40Composite materials

3Reliability

If thermal paste is used instead of thermal pad, then thermal resistance is reduced, but assembly tolerance absorption is lost

Engineering Contradiction:

Improvethermal resistanceVSAvoidstress buffering

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent employs phase change material that remains solid during assembly to provide stress buffering, then transitions to liquid state during operation to fill micro-gaps and maximize thermal contact, thereby achieving both tolerance absorption and low thermal resistance

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent creates a dynamic thermal interface that adapts its properties based on operational state - maintaining structural integrity during assembly and maximizing thermal conductivity during operation through phase transition

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces thermal resistance, prevents chip damage from vibrations and overpressure, and enhances heat dissipation efficiency by maintaining close contact between heat source components and the thermal module while allowing for flexibility and vibration absorption.

Implementation Method 1

thermal paste or phase change material provided between the top surface of each heat source component and the at least one heat transfer element

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

thermal paste or phase change material provided between the top surface of each heat source component and the at least one heat transfer element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10681800B1Thermal module mounting structure

Publication Date: 2020.06.09 ADLINK TECH INC

AI summary

A thermal module mounting structure includes a thermal module having a first bracket with mounting holes fixedly mounted at each of two opposite sides of a bottom wall thereof, a circuit board having one or multiple heat source components located on a top wall thereof and a second bracket with through holes fixedly mounted at each of two opposite sides of the top wall, and a plurality of fasteners respectively inserted through the through holes of the second brackets and fastened to the respective mounting holes of the first brackets to secure the circuit board to the thermal module in a vertically floatable manner and to keep the heat source components in contact with the bottom wall of the thermal module.