Semiconductor Die Package Integrating Bridge Circuit and Driver
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Solution Overview
Problem
Current display technologies face challenges in achieving space efficiency and flexibility due to the increasing demand for smaller, varied, and power-efficient system electronics, particularly in LCD systems, where compact and cost-effective electronics are difficult to develop.
Innovation Solution
A semiconductor die package is designed with a leadframe structure, integrated circuit die, and a plurality of semiconductor dice forming a bridge circuit, which includes half or full bridge configurations, allowing for compact and flexible electronics suitable for applications like LCD backlight inverters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If display size is reduced to achieve space efficiency, then area is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple electronic functions (bridge circuit and driver circuit) into a single integrated package. The bridge circuit includes multiple semiconductor dice (power MOSFETs, control MOSFETs) that are packaged together with the driver IC die, eliminating the need for separate discrete components and reducing overall device complexity despite smaller display area.
Solution Approach 2:
The integrated package serves multiple functions: it provides both the bridge circuit for power management and the driver circuit for LCD control. This multi-functional design reduces the number of separate electronic components needed, addressing the complexity issue while maintaining compact form factor.
2Area of stationary object
If display size is reduced to achieve space efficiency, then area is improved, but manufacturing cost increases
Solution Approach 1:
By integrating multiple semiconductor dice into a single package with the driver IC, the patent reduces the total component count and assembly steps. This consolidation simplifies the manufacturing process despite the smaller display area, helping to control costs.
3Adaptability or versatility
If power requirements are varied to match different display systems, then adaptability is improved, but device complexity increases
Solution Approach 1:
The bridge circuit is designed to accommodate varying power requirements through its configurable semiconductor dice arrangement. The package can be adapted to different power needs by selecting appropriate combinations of power MOSFETs and control MOSFETs, providing flexibility without requiring entirely different circuit designs.
Solution Approach 2:
The bridge circuit is divided into separate semiconductor dice (power MOSFETs, control MOSFETs) that can be independently selected and configured. This segmentation allows the circuit to be adapted to different power requirements by choosing appropriate dice combinations, maintaining versatility while managing complexity through modular design.
Data Source
AI summary
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.