Electronic Device Surge Protection via Ground Terminal
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Solution Overview
Problem
Power semiconductor devices in power conversion circuits are vulnerable to surge voltages, necessitating the use of expensive high-withstand voltage semiconductor elements.
Innovation Solution
An electronic device design that includes a semiconductor element with a thermally conductive support member, a heat sink, a thermally conductive insulating member, and a conductor layer configuration that allows surge voltage to be directed to a common ground, reducing the risk of semiconductor element damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-withstand voltage semiconductor elements are used to protect against surge voltage, then reliability is improved, but cost increases
Solution Approach 1:
A ground terminal is introduced as an intermediary component between the semiconductor element and the cooling medium container. This ground terminal provides a dedicated surge voltage discharge path, allowing standard (inexpensive) semiconductor elements to be protected from surge damage without requiring expensive high-withstand voltage components.
2Reliability
If a ground terminal with surge voltage discharge path is added, then reliability is improved, but device complexity increases
Solution Approach 1:
The ground terminal serves multiple functions simultaneously: it provides electrical grounding for the semiconductor element, creates a surge voltage discharge path to protect the semiconductor, and electrically connects to the container holding the cooling medium. By combining these functions into a single component, the patent avoids increasing device complexity while achieving surge protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of less expensive semiconductor elements by effectively managing surge voltages through the ground terminal, enhancing reliability and reducing costs.
Implementation Method 1
a thermally conductive support member for supporting the semiconductor element, a heat sink that is disposed on one surface of the circuit body to be thermally conductible
Implementation Method 2
a thermally conductive insulating member that is interposed between the heat sink and the thermally conductive support member
Implementation Method 3
a ground conductor layer that covers at least a part of the ground terminal and is electrically connected with the main body conductor layer
Data Source
AI summary
An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.