Multifunction Semiconductor Package Integrating Common Mode Filter and TVS
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Solution Overview
Problem
Existing semiconductor package designs are inefficient in integrating multiple functions due to the use of single-function passive components, leading to increased cost and space occupancy, and inadequate protection against overvoltage conditions such as electrostatic discharge and lightning.
Innovation Solution
A multifunction semiconductor package structure that integrates a substrate unit with a common mode filter, transient voltage suppressors, and a package unit, allowing for the electrical connection of multiple electronic elements to provide multiple functions, reducing package volume and manufacturing costs while enhancing protection against overvoltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple single-function passive components are used to provide different protection functions, then the protection coverage is improved, but the space occupancy and cost increase
Solution Approach 1:
The patent merges multiple single-function passive components into a single multifunction passive component that can provide different protection functions (such as common mode filtering and transient voltage suppression) simultaneously. This integration reduces the number of components needed and decreases overall space occupancy while maintaining comprehensive protection coverage.
Solution Approach 2:
The patent designs a multifunction passive component that can perform multiple protection functions within a single component structure. The component is configured to provide both common mode noise filtering and transient voltage suppression capabilities, allowing one component to replace what would traditionally require multiple separate components, thereby reducing space and cost.
2Reliability
If multiple single-function passive components are used to provide different protection functions, then the protection coverage is improved, but the manufacturing cost increases
Solution Approach 1:
The patent combines multiple protection functions into a single integrated passive component, reducing the total number of components that need to be sourced, assembled, and tested. This consolidation lowers manufacturing complexity and reduces overall production costs while maintaining comprehensive protection functionality.
Solution Approach 2:
By designing a universal multifunction passive component that can provide multiple protection functions, the patent eliminates the need to manufacture and assemble multiple separate single-function components. This multi-functionality approach reduces per-component costs and simplifies the supply chain, thereby reducing overall manufacturing cost.
3Reliability
If wire bonding is used to connect electronic elements, then the electrical connection is established, but high-frequency resonant issues occur
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the assembly method. Instead of using wire bonding to connect electronic elements, the design employs direct mounting or alternative connection methods that do not introduce the high-frequency resonant problems associated with wire bonds, particularly in the context of TVS diode and common mode filter integration.
Data Source
AI summary
A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes. Each lateral electrode is electrically connected to the corresponding first conductive layer and the corresponding conductive contact portion.