Memory Module Heat Dissipation Device with Dual Fan Airflow
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Solution Overview
Problem
Current heat dissipation methods for memory modules in computers, relying on natural convection and cooling plates, are ineffective in managing the increasing heat generated by high-speed electronic components, leading to potential overheating and reduced performance.
Innovation Solution
A heat dissipation device comprising two fixing frames, a connection frame, and two fans with coordinated air inlets and outlets, firmly attached to the motherboard's memory connectors using hooks and screws, to create a direct and efficient airflow path for heat dissipation from memory modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a cooling plate is disposed on the memory module to increase heat dissipation area, then the heat dissipation area is increased, but the heat dissipation effect is not good because heat cannot be effectively dissipated out of the memory module only in a natural convection way
Solution Approach 1:
The patent applies pneumatic principles by introducing fans to create forced air convection. Two fans are positioned at opposite ends of the memory module, drawing air through the memory module from both sides and expelling it through the cooling plate, transforming natural convection into forced convection for effective heat dissipation
Solution Approach 2:
The patent transitions from single-sided natural convection to multi-dimensional forced convection by positioning fans at both ends of the memory module. This creates airflow paths from multiple directions (left side, right side, and top surface), effectively utilizing three-dimensional space for heat dissipation
2Reliability
If fans are added to improve heat dissipation, then heat dissipation effect is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The cooling plate serves multiple functions: it acts as a heat dissipation surface, a structural support for mounting fans, and an airflow channel guide. The fixing frame also provides both structural support and mounting functionality for the entire assembly, reducing the need for separate components
Solution Approach 2:
The patent merges the cooling plate with the fan mounting structure, integrating heat dissipation and fan support functions into a single component. The fixing frame combines structural support and fan mounting capabilities, reducing overall device complexity
3Stability of the object's composition
If additional fixing structures are disposed on the motherboard to secure fans, then fan stability is improved, but motherboard space is occupied and manufacturing cost increases
Solution Approach 1:
The fixing frame serves dual purposes: it provides structural support for the entire heat dissipation assembly and simultaneously acts as a mounting structure for the fans. This eliminates the need for separate fixing structures on the motherboard, preserving motherboard space while ensuring fan stability
Solution Approach 2:
The patent combines the fan mounting function with the existing fixing frame structure. The fixing frame integrates both support and mounting capabilities, avoiding additional motherboard modifications and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a direct and effective heat dissipation method for memory modules, ensuring optimal operation without occupying additional motherboard space and reducing manufacturing costs by securely fixing fans in place, thus enhancing the thermal management of memory modules.
Implementation Method 1
two fans with the same air outlet direction are disposed at two ends of the memory module, respectively, to dissipate heat from the memory modules via heat convection between the memory modules
Data Source
AI summary
A heat dissipation device is used for dissipating heat generated from a plurality of memory modules inserted on a motherboard. The memory modules are parallel to each other. Two hooks are disposed at two ends of the slot of each memory connector, respectively, to clamp the memory module corresponding to the slot when the memory module is inserted in the slot. The heat dissipation device includes two fixing frames, a connection frame, and two fans. The two fixing frames are disposed at two opposite ends of the memory connectors and fastened with the hooks at two ends of each slot, respectively. Additionally, the connection frame is connected between the two fixing frames. The two fans are disposed on the two fixing frames, respectively. An air inlet of one of the two fans faces an air outlet of the other one.