Aqueous Ink Composition for Microchannel Etching Resist
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Solution Overview
Problem
Existing etching resist technologies face challenges such as environmental pollution from organic solvents, high costs, and inefficiencies in forming micro patterns due to the need for expensive exposure apparatuses and manual processes, as well as limitations in adhesive strength and resistance to etching solutions.
Innovation Solution
An ink composition using 2-50 parts by weight of an aqueous polymer or polymer emulsion and 10-95 parts by weight of water, with optional additives, that can be sprayed and thermally cured or dried to form a hard film suitable for microchannel formation, reducing environmental impact and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an organic solvent is used in the ink composition, then the polymer additive dissolves or disperses easily and exhibits excellent etching resistance, but the organic solvent pollutes the environment and is not suitable for forming micro patterns due to its small contact angle with the substrate
Solution Approach 1:
The patent changes the solvent type from organic to aqueous, fundamentally altering the chemical composition parameters of the ink. This substitution eliminates environmental pollution while maintaining etching resistance through the selection of water-soluble polymers and appropriate additives that function effectively in aqueous environments.
Solution Approach 2:
The patent introduces an aqueous solvent as an intermediary medium that replaces the organic solvent. This intermediary enables the dissolution or dispersion of polymer additives while eliminating the harmful environmental effects associated with organic solvents, and also improves the contact angle for micro pattern formation.
2Manufacturing precision
If a photoresist is used to form an etching resist pattern, then a pattern can be formed by selective etching, but an expensive exposure apparatus and a photomask with pre-designed pattern are required, which increases cost and processing time
Solution Approach 1:
The patent extracts and eliminates the complex exposure apparatus and photomask components from the pattern formation process. By using an inkjet printing system, the invention directly deposits the etching resist material in the desired pattern without requiring expensive exposure equipment, thereby reducing device complexity and cost while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces the optical-mechanical exposure system (photomask and exposure apparatus) with a direct inkjet deposition system. This substitution uses controlled material ejection mechanisms instead of optical projection, eliminating the need for expensive exposure hardware while achieving precise pattern formation through digital control of the inkjet printing process.
3Area of stationary object
If manual processes are used to form etching resist patterns, then patterns can be formed on large substrates, but the processes are expensive and require a long time
Solution Approach 1:
The patent implements a self-service automated inkjet printing system that directly forms etching resist patterns on large substrates without requiring manual intervention. The system automatically deposits material according to digital design data, enabling both large substrate coverage and high processing speed, thereby eliminating the trade-off between substrate size and processing time that exists in manual processes.
4Object-affected harmful factors
If an aqueous solvent is used instead of organic solvent, then environmental pollution is reduced and contact angle with substrate is improved, but the polymer additive must easily dissolve or disperse in water and the ink composition must be highly adhesive to metal substrate and have high resistance against etching solution
Solution Approach 1:
The patent changes the chemical parameters of the polymer additives to ensure water solubility or dispersibility. By selecting polymers with appropriate functional groups and molecular structures, the invention achieves easy dissolution or dispersion in aqueous environments while maintaining adhesion to metal substrates and resistance against etching solutions, thus overcoming the increased manufacturing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of environmentally friendly, high-adhesive, and resistant etching resist patterns with thermal curing, reducing costs and improving pattern precision, while preventing environmental pollution and eliminating the need for expensive exposure apparatuses.
Implementation Method 1
thermal curing or drying the sprayed ink composition
Implementation Method 2
drying the sprayed ink composition
Implementation Method 3
sprayed using an inkjet nozzle
Data Source
AI summary
Provided are an ink composition for an etching resist, a method of forming an etching resist pattern using the ink composition, and a method of forming a microchannel using the ink composition. The ink composition is suitable for forming a micro pattern due to its poor spreading on the substrate and is suitable for etching-resist for copper of a printed circuit board and deep etching a stainless steel substrate due to its excellent chemical properties that allow it to resist an etching solution.