Photosensitive Materials TRIZ Cases

Laser marking systems create multi-coloured codes directly on articles using selective irradiation of color formers.

Steroid-based photoacid generators produce sulfonic acids with controlled diffusion for chemically amplified resists.

Photo-acid generators switch solubility to remove barrier layers via wet etching, preserving photoresist integrity.

A radiation-sensitive resin composition with specific polymers and acid generators.

A sulfonium salt acid generator enhances chemically amplified resist sensitivity and resolution through controlled molecular structure.

Introducing a latent activator into aqueous coatings resolves the trade-off between safety and contrast, enabling durable black marks on paper.

An organic solvent and nitrogen-containing compound developer improves dissolution contrast to form fine resist patterns.

Block copolymer topcoats prevent photoresist leaching into immersion fluids while maintaining high receding contact angles to eliminate water mark defects.

A hardmask composition comprising specific polymer reactions and catalysts forms an antireflective underlayer film.

A lithographic printing plate precursor uses a hydrophilic polymer in its protective layer to inhibit mixing with image-recording components.

A difunctional monomer ink composition cures via actinic radiation to form durable images on recording media.

Hexafluoroalcohol polymer compositions increase dry etching speed, reducing etching time and preventing film loss during semiconductor pattern transfer.

Amine oxide additives neutralize airborne acids to eliminate T-top defects and maintain dimensional control in deep-UV lithography.

A negative resist composition uses a phenolic compound with specific substituents to enhance film uniformity and crosslinking ability.

A positive resist composition uses alkali-soluble units and acid-dissociable groups to achieve precise pattern formation.

Strong oxidants decompose gelatin from silver halide photosensitive layers, inhibiting ion migration between narrowed wiring intervals.

A resin composition forms an upper layer film with specific repeating units for liquid immersion lithography.

A hydrophobic alkali-soluble polymer protects the resist film from water-induced defects while merging removal with development to reduce process complexity.

Thermosetting silicon film composition enables high-quality resist patterning while resolving pattern collapse from insufficient etching resistance.

Acrylic resin with acid-dissociable groups and lactone units improves ion barrier properties during implantation.

A photosensitive polyimide resin composition uses radical generation to form precise interlayer insulating patterns on circuit substrates.