Photosensitive Materials TRIZ Cases

Laser marking systems create multi-coloured codes directly on articles using selective irradiation of color formers.

Steroid-based photoacid generators produce sulfonic acids with controlled diffusion for chemically amplified resists.

Photo-acid generators switch solubility to remove barrier layers via wet etching, preserving photoresist integrity.

A radiation-sensitive resin composition with specific polymers and acid generators.

A sulfonium salt acid generator enhances chemically amplified resist sensitivity and resolution through controlled molecular structure.

Introducing a latent activator into aqueous coatings resolves the trade-off between safety and contrast, enabling durable black marks on paper.

An organic solvent and nitrogen-containing compound developer improves dissolution contrast to form fine resist patterns.

Block copolymer topcoats prevent photoresist leaching into immersion fluids while maintaining high receding contact angles to eliminate water mark defects.

A hardmask composition comprising specific polymer reactions and catalysts forms an antireflective underlayer film.

A lithographic printing plate precursor uses a hydrophilic polymer in its protective layer to inhibit mixing with image-recording components.

A difunctional monomer ink composition cures via actinic radiation to form durable images on recording media.

Hexafluoroalcohol polymer compositions increase dry etching speed, reducing etching time and preventing film loss during semiconductor pattern transfer.

Amine oxide additives neutralize airborne acids to eliminate T-top defects and maintain dimensional control in deep-UV lithography.

A negative resist composition uses a phenolic compound with specific substituents to enhance film uniformity and crosslinking ability.

A positive resist composition uses alkali-soluble units and acid-dissociable groups to achieve precise pattern formation.

Strong oxidants decompose gelatin from silver halide photosensitive layers, inhibiting ion migration between narrowed wiring intervals.

A resin composition forms an upper layer film with specific repeating units for liquid immersion lithography.

A hydrophobic alkali-soluble polymer protects the resist film from water-induced defects while merging removal with development to reduce process complexity.

Thermosetting silicon film composition enables high-quality resist patterning while resolving pattern collapse from insufficient etching resistance.

Acrylic resin with acid-dissociable groups and lactone units improves ion barrier properties during implantation.

A photosensitive polyimide resin composition uses radical generation to form precise interlayer insulating patterns on circuit substrates.

A photoresist composition forms a hydrophilic surface to prevent intermixing with protective layers.

Photochemical decomposition of a polymerizable monomer creates high-resolution patterns, bypassing complex photolithography steps.

Thermal-treated bio-molecule and monomer composites improve biodegradable material heat-resistance and ductility while maintaining environmental compatibility.

Sprayed aqueous ink composition forms hard etching resist films on substrates, eliminating organic solvent pollution and expensive exposure apparatuses.

Dual-resin filtration removes high-polarity and minute contaminants from radiation-sensitive resin precursors, minimizing bridge defects.

A novel polymer compound enables precise resist pattern formation through controlled alkali solubility changes.

A positive resist composition uses acid-generating structural units to increase solubility in alkali developing solutions.

A resist composition uses a base component and photo-base generator to form negative-tone patterns via alkali development.

A lithographic printing plate precursor uses a specific surfactant in the developer to remove unexposed photosensitive layers effectively.

Room-temperature curing of this thiol-ene resist eliminates postannealing steps while achieving refractive indices up to 1.8.

A lithographic rinse solution containing nitrogen heterocyclic compounds enhances draining speed from patterned photoresist layers.

Distinct particle size distributions generate complex emission patterns that resist counterfeiting while maintaining simple detection.

Hydroxypyridine polymer suppresses acid diffusion to improve resolution and pattern profile while maintaining sensitivity.

A patterned photoresist layer uses a converted guard band to isolate wafer edge defects, preventing propagation into the inner semiconductor structure.

A polymer resist composition improves dissolution contrast and resolution through controlled molecular architecture.

A photocurable epoxy resin composition with controlled viscosity fills rugged substrate features to form uniform protective films.

A composite polymer system optimizes refractive indices and etching resistance to resolve trade-offs between manufacturing precision and antireflection effects.

A hard mask composition with specific structural units improves etching resistance during semiconductor pattern transfer.

A photosensitive resin composition uses a dye-polymer composite to enhance chemical and heat resistance in color filters.

Telescopic framework and adjustable belt tension extend vertical reach without disassembly, reducing project downtime.

A negative resist composition uses specific basic components to enhance crosslinking efficiency and substrate adhesion.

A polymerizable liquid composition forms a solidified imprinting layer with uniform silicon distribution through controlled component evaporation rates.

Auxiliary patterns compensate for phase defects in EUV masks, reducing labor-intensive correction processes.

A positive resist composition uses a sulfonium salt acid generator to produce high-resolution patterns.

A volume hologram photosensitive composition uses a composite binder resin to enhance monomer diffusion migration and refractive index modulation.

A photocurable surface layer with polar groups and metal oxide particles improves electrophotographic durability.