Arc-Shaped Slurry Groove Retainer Ring for CMP
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Solution Overview
Problem
Current chemical mechanical polishing (CMP) processes face challenges in efficiently introducing slurry, reducing noise and vibration, and enhancing material removal rates during semiconductor substrate processing.
Innovation Solution
A retainer ring with an arc-shaped slurry groove on its bottom surface, where the curvature radius of the groove is greater than the distance between the ring's center and the groove's curvature center, is integrated into a CMP apparatus and method, allowing increased slurry introduction, reduced noise and vibration, and improved material removal rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a conventional retainer ring design is used, then the structure is simple, but the amount of slurry introduction is insufficient
Solution Approach 1:
The retainer ring incorporates an arc-shaped slurry groove with a specific curvature radius relationship (curvature radius of slurry groove > distance from center to curvature center of groove). This curved geometry optimizes slurry flow dynamics and increases the amount of slurry introduced to the polishing pad, while maintaining a relatively simple overall ring structure.
2Object-affected harmful factors
If a conventional retainer ring design is used, then the structure is simple, but noise and vibration are reduced
Solution Approach 1:
The arc-shaped slurry groove with optimized curvature reduces turbulence and uneven slurry distribution, thereby minimizing vibrations and noise during CMP operation. The specific curvature radius relationship creates a smoother slurry flow pattern that dampens mechanical disturbances.
3Productivity
If a conventional retainer ring design is used, then the structure is simple, but the material removal rate is low
Solution Approach 1:
The curved slurry groove design enhances slurry distribution uniformity and increases the volume of slurry reaching the polishing interface. This improved slurry delivery directly increases the material removal rate by ensuring adequate chemical and mechanical action across the polishing pad surface.
Data Source
AI summary
Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. A curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.