Rotating Radiant Spot Heating for Substrate Temperature Uniformity
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Solution Overview
Problem
Semiconductor substrates experience temperature non-uniformity issues during processing, leading to valleys in deposition, which affects the uniformity of material deposition.
Innovation Solution
A thermal process chamber equipped with a spot heating source assembly that includes a motorized rotatable radiant spot heating source, a collimator holder, and a rotary stage, allowing for precise localized heating by projecting radiant energy along an arcuate path to adjust the impact point on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a stationary heating source is used to heat the substrate, then the heating source can maintain stable operation, but temperature non-uniformity occurs on the substrate leading to deposition valleys
Solution Approach 1:
The heating source is made dynamic by mounting it on a rotary stage that rotates it along an arcuate path. This dynamic movement allows the heating source to scan across different locations on the substrate, distributing heat more uniformly and eliminating the deposition valleys that occur with stationary heating sources.
Solution Approach 2:
The system applies local quality by using a focused radiant heating source that can be positioned at different locations on the substrate. By moving the heating source along an arcuate path, different regions of the substrate receive targeted heating, ensuring uniform temperature distribution across the entire substrate surface.
2Measurement precision
If the substrate is heated with strict temperature control, then the overall temperature can be maintained within tolerances, but localized valleys in deposition still form
Solution Approach 1:
The patent applies local quality by using a focused heating source that can be precisely positioned and moved to different locations on the substrate. This allows for localized temperature control at each position, ensuring that even though the overall temperature is controlled, each local region receives appropriate heating to prevent deposition valleys.
Solution Approach 2:
The dynamic movement of the heating source along an arcuate path enables the system to maintain precise temperature control while distributing heat uniformly across different locations. The motion allows the heating source to spend appropriate time at each location, ensuring uniform deposition without compromising overall temperature control precision.
3Adaptability or versatility
If a rotary stage with acute angle mounting is used for the heating source, then the impact point on the substrate can be adjusted along an arcuate path, but the device complexity increases
Solution Approach 1:
The patent uses a rotary stage to dynamically position the heating source, allowing the impact point to be adjusted along an arcuate path. This dynamic adjustment mechanism provides versatility in heating location while using a relatively simple rotary motion system rather than complex multi-axis positioning systems.
Solution Approach 2:
The heating source is mounted at an acute angle (between 45 and 85 degrees) relative to the rotation axis, creating an asymmetric configuration. This asymmetric mounting allows the heating source to trace an arcuate path during rotation, providing adjustable impact points across different locations on the substrate while maintaining a relatively simple single-axis rotation mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves temperature uniformity on the substrate, resulting in more uniform material deposition, reduces scrap, and extends the lifetime of the assembly by minimizing wear and sealing issues, while maintaining a high-pressure environment.
Implementation Method 1
a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window
Implementation Method 2
a collimator holder and a rotary stage disposed in a first plane, wherein the collimator holder is mounted to the rotary stage at an acute angle with respect to the first plane
Data Source
AI summary
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.