Charge Supports TRIZ Cases

See how rounded ridges and web-based hollow profiles reduce ceramic kiln furniture contact to p

See how vertically stacked loading stages with adjustable support arms resolve the contradictio

A post-and-member refractory support structure uses nitrogen bonded silicon carbide to keep kiln furniture stiff through repeated high-temperature cycles.

Non-conducting insulators isolate the tubular heater sheath from the housing to prevent ground faults, arcing, and mechanical failure.

A quartz support ring and pressure difference hold the wafer down during flash heating, preventing jump-induced cracking and flaws.

Elastic springs above the heater clamp absorb lift impacts, protecting ceramic heaters and wafers from rupture, damage, and contamination.

Robotic transfer and storage chambers keep substrates moving at high temperature, improving epitaxial throughput without exposing handling to the reactor.

An elastic spring damper cushions heater lift motion to prevent ceramic heater rupture, wafer damage, and chamber contamination.

Partition walls, exhaust ducts, and door packings isolate bake chamber zones to keep temperature, pressure, and humidity uniform across substrates.

Vacuum-cavity insulation plates at the furnace opening cut heat loss, shorten chamber stabilization time, and improve substrate temperature uniformity.

A mesh-and-body saggar lets mixed gas reach waste batteries for faster heat treatment, safer handling, and mixed-battery processing.

Independent vertical heating zones improve waste battery thermal efficiency, metal recovery, and control of harmful byproducts.

Localized radiant heating moves along an arcuate path to correct substrate temperature valleys and improve deposition uniformity in process chambers.

A cooled process tube flange uses an intermediate thermal layer to protect seals from overheating while limiting by-product condensation.

A rotating radiant spot heater sweeps an arcuate path to correct substrate temperature non-uniformity and improve deposition uniformity.

O-rings and fluid seals level the heater standoff to hold a consistent process gap, improving thermal uniformity and vacuum integrity.

A recessed, curved substrate support and barrier structure accommodates wafer bowing to improve thermal coupling, alignment, and deposition uniformity.

Fluid seals and a thermal shield stabilize heater gap alignment in batch chambers, improving thermal uniformity, repeatability, and vacuum integrity.

Elastic spring dampers in a heater lift assembly absorb vertical impact loads to protect ceramic heaters, wafers, and process cleanliness.

A hollow member beneath the heater creates a gas-flow space that improves wafer temperature uniformity and speeds gas replacement.

A vacuum-held flexible cover and local gas purge keep a protective atmosphere in the carrier recess, cutting oxidation, contamination, and cycle time.

Metal oxide or non-metal contact coatings on substrate supports block metal contamination and improve film thickness uniformity in semiconductor processing.

Dual-zone central and peripheral exhaust with gas ejection improves film thickness uniformity while recovering sublimate during substrate heat processing.

A monoblock chamber with stacked slit pockets improves substrate degassing heat transfer while maintaining throughput and reducing heater complexity.

A motorized radiant spot heater moves along an arcuate path to smooth substrate temperature and prevent deposition valleys in semiconductor processing.

Hot gas under a warped substrate forms an isothermal layer for even heating while continuously exhausting solvent vapor to keep the bake plate clean.

Vertical wall temperature zones replace costly pedestal heating to keep substrate temperature uniform within 2% during chamber processing.

A segmented gas ring uses a labyrinth flow path and sidewall heat conduction to prevent discoloration and preserve wafer heating.

Parallel slit pockets in a single metal block extend substrate heat treatment time while preserving throughput and reducing heater complexity.

Selective edge fixation and interlocking slits create a lighter grid carrier that stays stable and accessible in high-temperature processing.

Vertical shaft support with precisely fitted auxiliary hubs reduces axial run-out and oval deformation in large gearwheel heat treatment.

Directed gas channels heat both inner and outer bearing surfaces, improving heating efficiency while reducing furnace radial size and power use.

A graded MgO/CaO-zirconia setter uses a pure unstabilized ZrO2/HfO2 surface to prevent contamination, sticking, and cracking above 1650°C.

Independent heating zones and recirculated calcining gas improve temperature uniformity, cutting catalyst batch variation and fines.

A movable plug and support element relieves shear stress, clears powder buildup, and keeps heat-treatment racks precisely stackable.

Separate lid and body conveyors let reusable saggar lids cycle faster than worn bodies, cutting waste, cost, and energy use.

Elastic sealing rolls form plenum chambers on sintering belts, reducing abrasive wear and false air leakage in pellet and sinter plants.

A lightweight ceramic kiln support structure cuts thermal mass and heat loss while preserving load stability and extending insulation life.