Curved Substrate Support for Bowed Wafer Deposition Uniformity
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Solution Overview
Problem
Semiconductor substrates often deform during processing, leading to temperature non-uniformities and deposition non-uniformities, particularly in complex operations like high-temperature epitaxial deposition, which existing technologies fail to adequately address.
Innovation Solution
A substrate support system with a recessed surface and pocket surface design, including a barrier with protruding supports, is used to accommodate substrate deformation, ensuring thermal uniformity and reduced misalignment, and a transfer apparatus with an arcuate recessed surface to facilitate precise positioning and uniform gas flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional flat substrate support is used, then the structure is simple, but substrate deformation causes temperature non-uniformities and deposition non-uniformities
Solution Approach 1:
The substrate support features a recessed surface with a specific curvature radius that matches the expected substrate deformation profile. This localized geometric modification at the contact surface allows the support to accommodate bowed substrates, ensuring uniform thermal and deposition conditions across the substrate surface without requiring complex active control systems.
Solution Approach 2:
The recessed surface is designed with a curved geometry (arcuate shape) that corresponds to the natural deformation profile of substrates during processing. This curvature enables the support to maintain consistent contact pressure and thermal coupling with deformed substrates, eliminating the non-uniformities that would occur with a flat support surface.
2Reliability
If substrate deformation is not accommodated, then the support structure remains simple, but misalignment and defects increase
Solution Approach 1:
The barrier structure includes localized features such as recessed surfaces and protruding elements that specifically address substrate positioning and alignment. These localized geometric modifications ensure proper substrate placement and maintain alignment during processing, preventing defects without requiring complex active alignment systems.
3Manufacturing precision
If the substrate support does not account for deformation, then gas flow distribution becomes non-uniform, but the support design remains simple
Solution Approach 1:
The recessed surface curvature is designed to maintain optimal spacing between the substrate and opposing components (such as showerheads or effusion cells) even when the substrate is deformed. This geometric design ensures uniform gas flow distribution across the substrate surface, preventing deposition non-uniformities that would arise from variable spacing.
Data Source
AI summary
Embodiments of the present disclosure relate to substrate supports, transfer apparatus, processing chambers, and related components and methods, for substrate deformation (e.g., bowing). In one or more implementations, a substrate used in relation to the present disclosure can be deformed (e.g., bowed) before and/or during processing (such as epitaxial deposition). In one implementation, a substrate support applicable for use in semiconductor manufacturing operations includes a support body. The support body includes an outer surface, a recessed surface that is recessed relative to the outer surface, and a pocket surface between the outer surface and the recessed surface. The recessed surface and the pocket surface at least partially define a pocket of the support body. The support body includes a plurality of supports protruding relative to the recessed surface. The substrate support includes a barrier interfacing with the plurality of supports. The barrier includes a plurality of barrier supports.