Process Chamber Wall Zoning for Substrate Temperature Uniformity
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Solution Overview
Problem
Pedestal heaters in process chambers struggle to achieve substantial temperature uniformity across substrates due to limited zone control, RF arcing, and high manufacturing costs, leading to non-uniform heating and increased costs.
Innovation Solution
The process chamber design features vertically partitioned walls with multiple temperature control zones, allowing for individual control of heating and cooling to maintain temperature uniformity within 2% across substrates, using thermally coupled devices and a controller to manage temperature zones.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pedestal heaters are used to heat substrates, then heating capability is provided, but temperature uniformity across the substrate deteriorates
Solution Approach 1:
The process chamber is divided into multiple temperature control zones (first zone, second zone, third zone, fourth zone) with independent temperature control devices. Each zone can be controlled separately to achieve uniform temperature distribution across the substrate, resolving the contradiction between providing heating capability and maintaining temperature uniformity.
Solution Approach 2:
Different zones of the process chamber are assigned different temperature control characteristics. The temperature control devices are positioned to provide localized heating or cooling to specific areas, enabling precise temperature uniformity control across the substrate while maintaining overall heating capability.
2Temperature
If pedestal heaters are used, then substrate heating is achieved, but manufacturing cost increases
Solution Approach 1:
Multiple temperature control zones are merged into a single integrated process chamber design. By combining the heating and cooling functions into one chamber with multiple controllable zones, the system achieves substrate heating capability while reducing the need for separate expensive pedestal heater assemblies.
Solution Approach 2:
The process chamber walls and temperature control devices serve multiple functions: they provide structural containment, enable temperature control, and facilitate uniform heating across the substrate. This multi-functionality reduces manufacturing costs by eliminating the need for dedicated pedestal heater components.
3Manufacturing precision
If multiple temperature control zones are implemented, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
Multiple temperature control zones are merged into the process chamber wall structure rather than being implemented as separate complex components. The zones are integrated into the chamber design, reducing overall device complexity while maintaining the ability to achieve temperature uniformity through coordinated control of the different zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity across substrates, improving deposition and etching processes while reducing manufacturing costs by allowing more precise control and reducing the need for expensive pedestal heaters.
Implementation Method 1
a temperature control device thermally coupled to the one or more vertical walls in each of the multiple zones
Data Source
AI summary
A process chamber includes one or more vertical walls at least partially defining a chamber portion of the process chamber, and multiple zones located about a periphery of the one or more vertical walls, wherein one or more of the multiple zones extends from a top to a bottom of the one or more vertical walls. The process chamber further includes a plurality of temperature control devices, each thermally coupled to the one or more vertical walls in one of the multiple zones, and a controller coupled to the plurality of temperature control devices and configured to set temperatures of one or more of the plurality of temperature control devices to obtain temperature uniformity within 2% across a substrate located in the chamber portion.