Substrate Support Coating for Uniform Film Thickness
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Solution Overview
Problem
In semiconductor device manufacturing, there is a challenge in achieving uniform film thickness and suppressing metal contamination on substrates during the film-forming process.
Innovation Solution
A substrate support system with metal oxide and non-metal materials is used to support substrates in a process chamber, where the support columns and pins are coated with metal oxide or non-metal films to prevent metal contamination and ensure uniform gas flow, thereby improving film thickness uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metal support columns and pins are used to support substrates, then structural strength and stability are improved, but metal contamination of substrates and films occurs
Solution Approach 1:
A coating layer made of metal oxide or non-metal material is applied on the surface of the metal support columns and pins. This coating acts as an intermediary between the metal support structure and the substrate, preventing direct contact and thus preventing metal contamination while maintaining the structural strength of the metal support.
2Stability of the object's composition
If metal support structures are used, then mechanical stability is improved, but film thickness uniformity deteriorates due to metal contamination
Solution Approach 1:
The coating layer of metal oxide or non-metal material serves as a barrier that prevents metal atoms from transferring to the substrate during the film formation process. This eliminates metal contamination that would otherwise cause non-uniform film thickness, while the underlying metal support structure continues to provide mechanical stability.
3Device complexity
If metal support components are used, then device complexity is reduced, but metal contamination increases
Solution Approach 1:
Instead of replacing the simple metal support structure with a complex non-metal alternative, a relatively simple coating layer is applied to the metal support. This coating layer effectively prevents metal contamination while adding minimal complexity to the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses metal contamination and enhances the uniformity of film thickness on substrates, improving the overall quality of semiconductor devices.
Implementation Method 1
the plurality of supports includes at least a contact portion configured to make contact with the plurality of substrates and made of at least one selected from the group of a metal oxide and a non-metal material
Implementation Method 2
a heater configured to heat the plurality of substrates accommodated in the process chamber
Data Source
AI summary
There is provided a technique that includes a substrate support including a support column made of metal and a plurality of supports installed at the support column and configured to support a plurality of substrates in multiple stages; a process chamber configured to accommodate the plurality of substrates supported by the substrate support; and a heater configured to heat the plurality of substrates accommodated in the process chamber, wherein the plurality of supports includes at least a contact portion configured to make contact with the plurality of substrates and made of at least one selected from the group of a metal oxide and a non-metal material.