Rotary Spot Heating Assembly for Substrate Temperature Uniformity
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Solution Overview
Problem
Semiconductor substrates experience temperature non-uniformity during processing, leading to valleys in deposition, which affects the uniformity of material deposition.
Innovation Solution
A thermal process chamber equipped with a spot heating source assembly that includes a motorized rotatable radiant heating source configured to project energy through a collimator holder and rotary stage, allowing for localized heating of specific areas on the substrate by moving along an arcuate path to adjust the energy impact point.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a stationary heating source is used, then the heating system is simple, but temperature uniformity on the substrate deteriorates
Solution Approach 1:
The heating source is made dynamic by mounting it on a rotary stage that rotates it along an arcuate path, allowing the stationary heating source to sweep across different positions and achieve uniform temperature distribution on the substrate through motion
Solution Approach 2:
The collimator holder is mounted at an acute angle to direct radiant energy to specific local areas of the substrate, enabling localized heating control while maintaining overall temperature uniformity through selective regional heating
2Adaptability or versatility
If the collimator holder is mounted perpendicular to the rotary stage, then the structure is simple, but the energy impact point cannot be adjusted
Solution Approach 1:
The collimator holder is mounted at an acute angle (asymmetric configuration) rather than perpendicular to the rotary stage, enabling the radiant energy to be directed at adjustable angles and positions on the substrate, providing adaptability for different heating requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances temperature uniformity on the substrate, improving deposition uniformity and reducing temperature non-uniformities, leading to higher substrate quality and reduced scrap rates, while also minimizing bulk and maintenance issues.
Implementation Method 1
a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window
Implementation Method 2
A spot heating source assembly comprises a collimator holder and a rotary stage disposed in a first plane
Data Source
AI summary
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.


