Bake Chamber Partition Sealing for Uniform Heat Treatment Atmosphere
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Solution Overview
Problem
The issue of nonuniform process atmosphere (temperature, pressure, humidity) in multiple processing spaces of a bake chamber due to airflow, leading to deteriorated reliability of substrate processing in semiconductor fabrication.
Innovation Solution
A substrate processing apparatus with a bake chamber featuring a first partition wall that divides the space into separate heat treatment areas, coupled with exhaust ducts and sealings to maintain uniform process conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple processing spaces are provided in the bake chamber, then processing capacity is improved, but process atmosphere uniformity deteriorates
Solution Approach 1:
The bake chamber is divided into multiple independent processing spaces using partition walls. Each processing space can be independently controlled for temperature, pressure, and humidity, allowing multiple substrates to be processed simultaneously while maintaining uniform process atmosphere in each space. The partition walls include sealing structures that prevent airflow interference between adjacent spaces.
Solution Approach 2:
Each processing space is equipped with independent heating elements, temperature sensors, and control systems tailored to its specific requirements. This allows different regions of the bake chamber to have different temperature profiles and process conditions optimized for different substrate types or processing stages, while maintaining uniformity within each local space.
2Reliability
If partition walls are added to separate processing spaces, then process atmosphere control is improved, but device complexity increases
Solution Approach 1:
The partition walls are designed as modular components that can be independently installed and adjusted. Each partition wall includes integrated sealing brackets and packing structures, reducing the need for additional complex sealing mechanisms. The modular design simplifies maintenance and allows for easy reconfiguration of the number and arrangement of processing spaces.
Solution Approach 2:
The partition walls serve multiple functions simultaneously: they separate processing spaces, provide structural support for heating elements and sensors, incorporate sealing mechanisms to prevent airflow mixing, and offer mounting surfaces for exhaust ducts and other process control components. This multi-functionality reduces the overall number of separate components needed.
3Reliability
If sealing structures are added at the chamber door, then process atmosphere stability is improved, but manufacturing complexity increases
Solution Approach 1:
The sealing system is divided into multiple independent packing structures positioned at different locations along the chamber door and partition walls. Each packing structure can be independently installed and adjusted, allowing for simplified manufacturing and assembly. The segmented sealing approach enables easier replacement and maintenance of individual sealing components without affecting the entire door assembly.
Solution Approach 2:
The sealing packings are designed as flexible elastic structures that can deform to accommodate manufacturing tolerances and thermal expansion. These flexible sealing elements maintain effective seals between the chamber door, partition walls, and bake chamber body without requiring precision-machined rigid sealing surfaces, thereby simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of substrate processing by ensuring consistent atmospheric conditions across different processing spaces, thereby improving the quality and consistency of semiconductor fabrication.
Implementation Method 1
a first heating stage configured to heat a substrate
Implementation Method 2
a first cooling stage configured to cool a substrate
Implementation Method 3
a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces and through which gas exhausted from the first heat treatment modules is introduced
Data Source
AI summary
A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.