Arcuate Slit Door for Plasma Confinement in Substrate Processing
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Solution Overview
Problem
The presence of substrate transfer slots in capacitively coupled plasma chambers interferes with the uniformity of deposition on substrates during semiconductor processing, disrupting plasma confinement and current flow.
Innovation Solution
A slit door with an arcuate profile is introduced, coupled to an actuator that moves vertically and horizontally to selectively seal or expose the substrate transfer slot, ensuring electrical continuity and reducing plasma leakage, thereby improving deposition uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrate transfer slots are provided in the conductance liner for substrate transfer, then substrate loading and unloading is enabled, but plasma confinement and deposition uniformity deteriorate
Solution Approach 1:
The harmful effect of the transfer slot on plasma confinement is extracted and isolated by introducing a separate slit door component that can be selectively positioned to cover the slot during plasma processing, while maintaining the slot's functionality for substrate transfer when needed
Solution Approach 2:
The slit door is made movable between open and closed positions, allowing dynamic adjustment of the transfer slot coverage based on operational requirements - closed during plasma processing to maintain uniformity, open during substrate transfer to enable operation
2Productivity
If the transfer slot is exposed during processing, then substrate transfer is facilitated, but plasma leakage and particle generation increase
Solution Approach 1:
The slit door provides preliminary protection by covering the transfer slot before plasma processing begins, preventing plasma leakage and particle generation at the slot interface, while allowing quick removal when substrate transfer is required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The slit door enhances deposition uniformity by maintaining plasma confinement and preventing unwanted particle generation, ensuring consistent substrate processing results.
Implementation Method 1
an actuator coupled to the slit door and configured to move the slit door in both a vertical direction and a horizontal direction to selectively seal or expose the substrate transfer slot of the liner
Implementation Method 2
The slit door enhances deposition uniformity by maintaining plasma confinement and preventing unwanted particle generation
Implementation Method 3
the second plate has a processing volume facing surface that includes polysilicon
Implementation Method 4
In capacitively coupled plasma chambers, conductance liners are used to contain the plasma generated in a process volume of the chamber and to provide an RF ground return path
Implementation Method 5
Deposition and etch chambers used in the manufacturing of semiconductor devices need to produce consistent and uniform results for every substrate that is processed
Data Source
AI summary
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit includes a slit door having an arcuate profile and including a first plate coupled to a second plate, wherein the first plate is configured to be coupled to an actuator, and wherein the second plate has a processing volume facing surface that includes silicon.