Electric Discharge Tubes TRIZ Cases

Variable frequency generators adjust RF power waveforms to minimize reflected energy in plasma processing chambers.

A plasma generator arrangement with a gas rectifier stabilizes reactant flow for uniform film deposition.

Divergent jet columns and spatial masks ensure homogeneous coatings on large substrates while maintaining jet integrity.

A plasma adjusting unit with a ferromagnetic core equalizes plasma density, resolving non-uniform etching rates between center and peripheral substrate areas.

A high-purity copper sputtering target integrates a hardened flange with an oriented erosion zone to eliminate backing plate requirements.

Soft pulsing applies controlled slope ramps to radio frequency signals, preventing plasma impedance instability and maintaining precise etching control.

Pixelated electromagnets replace slow fluid loops to eliminate hot spots and control etch rates.

A busbar module connector secures plates without loading electric wires, enabling single-mold manufacturing.

A charged particle beam apparatus adjusts quadrupole field excitation amounts to align the line cross position with the optical axis center.

Segmented electrical contact with flexible wipes accommodates 15 and 20 amp plug orientations, reducing material usage and simplifying manufacturing.

A plasma processing apparatus temperature controller adjusts coolant flow rates via a three-way valve to resolve thermal non-uniformities across the substrate.

Slanted connecting terminals on flexible substrates adjust height by replacing the supporting body, maintaining signal integrity.

A blanking device uses two-dimensional shift register arrays to reduce clock operations and heating values in multi-charged particle beam systems.

A charged-particle beam device uses a control device to adjust deflector voltage based on detector output for stable signal electron trajectories.

Optical fiber transmission replaces electrical wiring in a charged particle beam modulator, reducing power losses and enabling higher component density.

Direct-write particle beam patterning creates conformal masks without photoresist, resolving the trade-off between sub-45nm precision and process complexity.

A plasma control method monitors process parameters to determine temporal features of arc discharges for targeted countermeasure execution.

Sequential DSP and nitric acid soaking with hot deionized water sealing reduces metal contamination on anodized aluminum while maintaining corrosion resistance.

Adjustable sinusoidal wave currents shift the plasma locus center to align with the substrate, resolving film thickness non-uniformity.

Tiltable outer power applicator corrects asymmetrical etch rate distributions caused by vacuum pump placement.

Vertical stacking of buffer and transfer chambers reduces installation area while maintaining vacuum integrity for substrate processing.

A position measuring apparatus uses a segmented holder with three-point support and vacuum chuck members to detect pattern positional deviations on EUV masks.

A sputtering cathode cooling plate uses selective partition plates to maintain coolant flow rigidity.

Periodic plasma extinction phases introduce negative ions to neutralize positive charge accumulation, maintaining etching rate and profile accuracy.

Periodic oxygen plasma cleaning prevents quartz deterioration and particle generation while sustaining ashing efficiency.

Heated annular member promotes fluorine radical recombination to reduce edge etch rate variations.

Segmented p-type and n-type conductors create distinct vacuum gaps that enhance energy transfer efficiency by reducing thermal leakage.

Vertical spring arm stacking improves contact flexibility while maintaining compact width for high-density PCB applications.

A tuning system adjusts dual level pulsed RF power to optimize impedance matching in plasma processing chambers.

A grounded contact pin applies a controlled electrical pulse to break down the wafer backside insulating layer.

Ion implantation power supply modifications reduce voltage glitch duration to maintain dose uniformity.

Scanning a dot mark with a focused beam detects scattered electrons, enabling high-precision resolution measurement without complex hardware.

A showerhead gas distribution plate couples to the body via a clamp for independent replacement.

Modifying the plasma sheath boundary shape directs ions at varied angles across resist features, reducing line width roughness by up to 48%.

Remote plasma and ultraviolet scavenging in vacuum transfer chambers eliminate moisture-induced aging defects while maintaining wet etching selectivity.

Segmented gas supply plates distribute reaction gas uniformly across substrates, resolving plasma generation efficiency and surface damage trade-offs.

Helical electrodes rotate plasma to transform DC voltage, reducing complexity and cost for long-distance transmission.

Segmenting the detector array enables dark field imaging in multi-beam SEM systems, resolving throughput-versus-versatility contradictions.

A viscoelastic body between the ion pump and lens barrel reduces natural vibration, preserving resolution without increasing weight.

Boundary-disposed conduits deliver plasma to exhaust volumes, breaking down particles generated by mechanical contact.

A measurement unit located outside a load lock chamber detects particle levels through a dedicated passage.

A controlled gas mixture containing fluorine and oxygen suppresses carbon deposition on high voltage components, extending ion source life.

Dual secondary coils distribute power to expand the adjustable range of ion energy incident on the workpiece.

Meshed gear elements drive a dual-axis rotation mechanism that overcomes limited angular range constraints in SEM and FIB tomographic analysis.

A segmented plasma nitriding apparatus houses only the treatment region in a tank to deposit nitrogen ions via plasma.

Precomputed lookup tables replace complex real-time calculations, enabling swift muon track detection without additional transit time detectors.

A semi-spheroidal magnetic rod tip contacts a pole to transmit fields while accommodating positional deviations.

Coupling a manipulation tool to a gas injection nozzle eliminates dedicated actuators, reducing device complexity and cost.

Hydrogen radicals and ozone gas selectively etch photoresist without damaging low-k dielectrics, preventing dielectric constant increases that cause RC delays.

A movable arcuate slit door covers substrate transfer slots to prevent plasma leakage and improve deposition uniformity.