Charged Particle Beam Modulator With Optical Fiber Control
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Solution Overview
Problem
Charged particle lithography systems face challenges in achieving high density of components in the modulation device, limiting their performance due to the constraints of modulator pitch, wiring, and power losses, which hinder high-speed and high-frequency modulation for smaller critical pattern dimensions and higher throughput in the semiconductor industry.
Innovation Solution
The system employs a charged particle lithography system with a beamlet generator producing a large number of parallel electron beamlets, a beamlet modulator using a CMOS device with electrostatic deflectors, and a control unit transmitting modulated light beams to light-sensitive elements close to the modulators, minimizing wiring length and power losses, and optimizing the layout of beam and non-beam areas to reduce pitch and enhance component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of modulators is decreased to increase component density, then the number of modulators can be increased for smaller critical dimensions, but the area required for modulator, light sensitive element and wiring combination limits further density improvement
Solution Approach 1:
The patent positions light sensitive elements in the vertical dimension above the modulator array plane, allowing optical signal transmission through a third dimension rather than requiring lateral wiring connections. This dimensional transition eliminates the area constraint imposed by planar wiring and enables higher modulator density.
Solution Approach 2:
Optical fibers serve as intermediaries to transmit control signals from light sensitive elements to modulators. This optical mediation replaces direct electrical wiring, enabling signal transmission without occupying lateral space and allowing modulators to be positioned closer together.
2Device complexity
If light sensitive elements are relocated to a large distance from modulators to simplify wiring, then wiring complexity is reduced, but power losses increase and high-speed modulation cannot be achieved
Solution Approach 1:
The patent replaces electrical wiring connections with optical fiber transmission. Light sensitive elements convert electrical signals to optical signals, which are then transmitted through optical fibers to modulators. This substitution eliminates resistive power losses associated with long electrical wiring while maintaining signal integrity for high-speed modulation.
3Productivity
If the density of modulation device components is increased for higher throughput, then smaller critical pattern dimensions can be achieved, but manufacturing and alignment become more difficult
Solution Approach 1:
The patent integrates light sensitive elements and modulators into a unified three-dimensional structure where elements are vertically aligned above corresponding modulators. This merging of components into a compact assembly simplifies manufacturing by reducing the number of separate alignment operations required compared to distributed lateral connections.
Solution Approach 2:
By transitioning from a two-dimensional planar layout to a three-dimensional vertical arrangement, the patent enables higher component density within the same footprint while maintaining alignment precision. The vertical positioning of light sensitive elements above modulators creates a more compact and manufacturable structure.
4Adaptability or versatility
If wiring length is increased to connect light sensitive elements to modulators, then routing flexibility is improved, but power losses and signal degradation increase
Solution Approach 1:
Optical fibers act as intermediaries that can be routed flexibly through space without suffering from resistive power losses. The optical signal transmission medium allows wiring to be routed adaptably to accommodate different modulator positions while maintaining signal integrity and minimizing energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for reliable high-density operation of the modulation device, enabling high-speed and high-frequency pattern transfer with improved throughput and precision, addressing the limitations of existing systems by reducing modulator pitch and power losses while maintaining system performance.
Implementation Method 1
The transmitted light beams are received by light sensitive elements and then converted to electric signals
Implementation Method 2
the beamlets are modulated by electrostatic deflection
Data Source
Figure 1~5
Figure 2~3A
Figure 3B~4
AI summary
The invention relates to a charged particle lithography system for transferring a pattern onto the surface of a target. The system comprises a beam generator, a beam stop array and a modulation device. The beam generator is arranged for generating a plurality of charged particle beamlets, the plurality of beamlets defining a column. The beam stop array has a surface for blocking beamlets from reaching the target surface and an array of apertures in the surface for allowing the beamlets to reach the target surface. The modulation device is arranged for modulating the beamlets to prevent one or more of the beamlets from reaching the target surface or allow one or more of the beamlets to reach the target surface, by deflecting or not deflecting the beamlets so that the beamlets are blocked or not blocked by the beam stop array. The modulation device comprises a plurality of apertures with associated modulators; and a plurality of light sensitive elements, both arranged in arrays. A surface area of the modulation device comprises an elongated beam area comprising an array of apertures and associated modulators, and a power interface area for accommodating a power arrangement for suitably powering elements within the modulation device. The power interface area being located alongside a long side of the elongated beam area and extending in a direction substantially parallel thereto.