Vertically Overlapping Buffer and Transfer Chambers for Substrate Processing

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Solution Overview

Problem

Existing substrate processing systems require large installation areas due to the need for intermediate transfer chambers that interfere with the movement of transfer robots, leading to inefficient use of space.

Innovation Solution

A substrate processing system with vertically overlapping buffer chambers and transfer chambers, allowing transfer robots to operate at different heights and reducing the need for extensive intermediate transfer spaces, thus minimizing the installation area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If intermediate transfer chambers are used to connect vacuum processing chambers, then substrate transfer can be performed, but the installation area increases significantly

Engineering Contradiction:
Improvesubstrate transfer capabilityVSAvoidinstallation area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The buffer chamber is positioned vertically above the first substrate transfer chamber, utilizing the vertical dimension to reduce horizontal footprint. This stacked configuration allows substrate transfer operations to occur in three-dimensional space rather than requiring extended horizontal area, directly resolving the contradiction between transfer capability and installation area size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If intermediate transfer chambers are positioned horizontally, then substrate transfer between chambers is enabled, but the transfer robot movement space is interfered with

Engineering Contradiction:
Improvesubstrate transfer functionVSAvoidtransfer robot movement
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

By relocating the buffer chamber from horizontal to vertical positioning above the transfer chamber, the invention separates the substrate storage function from the transfer robot's horizontal movement path. This dimensional reorganization eliminates interference between the transfer robot and buffer chamber, allowing smooth robot operation while maintaining substrate transfer functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If vertically overlapping buffer chamber and transfer chamber are used, then installation area is minimized, but vacuum environment maintenance becomes more complex

Engineering Contradiction:
Improveinstallation areaVSAvoidvacuum environment control
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The vacuum system is segmented into independent vacuum chambers (processing chambers and transfer chamber) with controlled connections through gate valves. This segmentation allows each chamber to maintain its own vacuum environment independently, simplifying the overall vacuum control architecture despite the vertical stacking configuration, and enabling selective isolation of chambers during operations.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11721564B2Substrate processing system and substrate transfer apparatus and method
Publication Date: 2023.08.08 TOKYO ELECTRON LTD
  • US11721564B2 patent drawing
  • US11721564B2 patent drawing
  • US11721564B2 patent drawing

AI summary

A substrate processing system includes a first substrate processing chamber, a first substrate transfer chamber connected to the first substrate processing chamber, a second substrate processing chamber, and a second substrate transfer chamber connected to the second substrate processing chamber. The substrate processing system further includes a buffer chamber connected between the first substrate transfer chamber and the second substrate transfer chamber, the buffer chamber having at least one substrate holder. At least a part of the buffer chamber and at least one of the first substrate transfer chamber or the second substrate transfer chamber are vertically overlapped with each other.