Plasma Processing Apparatus Scanning Magnetic Field Locus Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In plasma processing, the plasma flow can drift due to localized rotary magnetic field strengths, causing the center of plasma flow rotation or locus to shift from the substrate center, leading to non-uniform substrate processing, such as uneven film thickness.

Innovation Solution

A plasma processing apparatus with a scanning magnetic field generator that adjusts the plasma locus by generating a magnetic field capable of deflecting and scanning the plasma, using adjustable DC and sinusoidal wave currents to align the plasma center with the substrate, ensuring uniform plasma distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a rotary magnetic field is used to rotate plasma flow, then plasma can be generated and transported to the processing chamber, but the plasma flow may drift and the center of plasma flow rotation shifts from the substrate center due to localization of magnetic field strength

Engineering Contradiction:
Improveplasma flow rotation speedVSAvoidplasma locus center alignment
Core Design Contradiction:
SpeedVSManufacturing precision

Solution Approach 1:

The control unit adjusts the amplitude of the sinusoidal wave current based on the position of the plasma locus center detected by the position detector. This feedback mechanism continuously corrects the plasma rotation to maintain precise alignment with the substrate center, resolving the drift issue caused by localized magnetic field strength.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system changes the amplitude parameter of the sinusoidal wave current applied to the scanning magnetic field generator. By dynamically adjusting this parameter, the plasma locus center position is controlled to align with the substrate center, thereby improving manufacturing precision while maintaining plasma rotation speed.

Inventive Principle:
Principle #35Parameter changes

2Device complexity

If the plasma flow center is shifted from the substrate center, then plasma transport is simplified, but uniform substrate processing cannot be achieved

Engineering Contradiction:
Improveplasma transport controlVSAvoidfilm thickness uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The position detector detects the plasma locus center position and feeds this information to the control unit, which adjusts the sinusoidal wave current amplitude to reposition the plasma center over the substrate center. This feedback ensures uniform film thickness while maintaining relatively simple plasma transport control.

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If a scanning magnetic field is introduced to deflect plasma, then plasma locus can be adjusted, but the system complexity increases

Engineering Contradiction:
Improveplasma locus controlVSAvoidmagnetic field generation system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The scanning magnetic field generator serves multiple functions: it deflects plasma to control the locus center position and also works in conjunction with the sinusoidal wave current to maintain plasma rotation. This multi-functionality reduces the need for separate control mechanisms, thereby limiting the increase in system complexity while improving plasma locus control precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This technique allows for uniform substrate processing by precisely controlling the plasma locus, resulting in consistent film thickness and improved processing outcomes.

Implementation Method 1

a scanning magnetic field generator configured to generate a magnetic field for deflecting the plasma so as to scan the substrate by the plasma

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

a plasma generator configured to generate a plasma... generating an arc plasma between a cathode and an anode by arc discharge

Methodology Applied
Scientific EffectArc discharge: Electric Arc

Data Source

PatentUS10971332B2Plasma processing apparatus and plasma processing method
Publication Date: 2021.04.06 CANON ANELVA CORP
  • US10971332B2 patent drawing
  • US10971332B2 patent drawing
  • US10971332B2 patent drawing

AI summary

A plasma processing apparatus includes a processing chamber configured to process a substrate, a plasma generator configured to generate a plasma, a transport unit configured to transport, to the processing chamber, the plasma generated by the plasma generator, and a scanning magnetic field generator configured to generate a magnetic field which deflects the plasma so as to scan the substrate by the plasma. The scanning magnetic field generator is configured to be capable of adjusting a center of a locus of the plasma.