Cathode Cooling Plate with Localized Partition Omission
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Solution Overview
Problem
In sputtering film formation processes, the target material experiences localized high temperatures due to strong leakage magnetic fields, leading to thermal expansion and potential detachment from the cooler, which can result in inadequate cooling and increased erosion, especially when using low-thermal-conductivity materials like titanium or ceramics.
Innovation Solution
The cathode unit incorporates a cooling plate with a specific partition plate configuration, where first partition plates are absent in high-temperature regions and only second partition plates are present, allowing for flexible deformation and maintaining the cooling medium flow, thus preventing detachment and ensuring effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling plate with partition plates is used to cool the target, then cooling efficiency is improved, but thermal expansion in high-temperature regions causes detachment
Solution Approach 1:
The cooling plate is designed with different structural characteristics in different regions: the high-temperature region has no first partition plate to allow thermal expansion, while other regions have complete partition plates for effective cooling. This local differentiation resolves the contradiction by allowing each region to have the quality it needs.
Solution Approach 2:
The cooling plate is segmented into different functional zones using partition plates, with the high-temperature region being a separate segment without first partition plates. This segmentation allows the cooling system to address different thermal conditions in different areas independently.
2Productivity
If the cooling plate is made rigid to maintain cooling medium flow, then cooling efficiency is maintained, but thermal expansion is restricted causing stress and detachment
Solution Approach 1:
The cooling plate structure is locally differentiated with second partition plates providing rigidity in low-temperature regions to maintain cooling medium flow, while the high-temperature region lacks first partition plates to allow stress-free thermal expansion. This resolves the contradiction between rigidity and thermal expansion.
3Stability of the object's composition
If partition plates are added to improve cooling uniformity, then temperature distribution is improved, but the structure becomes more complex and prone to detachment
Solution Approach 1:
Instead of uniformly adding partition plates throughout the cooling plate, the invention applies them only where needed: second partition plates are used in low-temperature regions to maintain cooling uniformity, while first partition plates are omitted from the high-temperature region to prevent detachment. This selective application reduces overall complexity while maintaining temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses target detachment and maintains cooling efficiency, even during thermal expansion, by allowing the cooling plate to deform in high-temperature regions and maintaining the rigidity needed for cooling medium flow in lower temperature areas.
Implementation Method 1
a cooling plate made of a metal to which the target is bonded
Implementation Method 2
a cooling medium flow space through which a cooling medium flows
Implementation Method 3
the target material experiences localized high temperatures due to strong leakage magnetic fields
Implementation Method 4
allowing for flexible deformation and maintaining the cooling medium flow
Implementation Method 5
leading to thermal expansion and potential detachment from the cooler
Data Source
AI summary
A cathode unit for performing a sputtering film formation includes: a target that emits sputtering particles; a target cooler that includes a cooling plate to which the target is bonded; and a power supply that supplies a power to the target. The target has a high-temperature region that has a higher temperature than other regions of the target during a film formation. The cooling plate includes a coolant flow space through which a coolant flows, and a first wall and a second wall that define the coolant flow space in a thickness direction. In the coolant flow space, a flow path of the coolant is formed by a first partition plate and a second partition plate. The first partition plate does not exist at a portion of the coolant flow space that corresponds to the high-temperature region.