Organic Film Planarizing Agent for Fine Pattern Filling and Etch Resistance
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Solution Overview
Problem
Current multilayer resist methods for semiconductor manufacturing face challenges in achieving high planarizing ability, especially when dealing with substrates featuring fine pattern structures like holes and trenches, where existing methods struggle to fill patterns without voids and planarize steps between patterned and unpatterned regions effectively.
Innovation Solution
A planarizing agent comprising an aromatic-group-containing compound with a molecular weight of 200 to 500, which when blended with a resin and solvent, exhibits thermal flowability and reduces residue, ensuring high planarization without impairing etching resistance, and is preferably a benzene-ring-containing compound for improved solubility and compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing planarizing methods are used on substrates with fine pattern structures, then the substrate surface can be planarized to some extent, but voids remain in patterned regions and planarization is insufficient between patterned and unpatterned regions
Solution Approach 1:
The patent changes the chemical composition parameters of the organic film by incorporating specific compounds (silicon-containing compounds, aromatic compounds, and compounds with molecular weight 200-500) to achieve both excellent planarization and filling ability. This compositional parameter change enables the film to simultaneously fill fine patterns without voids and planarize the substrate surface effectively.
Solution Approach 2:
The patent creates a composite organic film material combining multiple functional components: silicon-containing compounds for etching resistance and planarization, aromatic compounds for film formation stability, and low molecular weight compounds (200-500) for enhanced filling ability. This composite material approach resolves the contradiction between planarization quality and filling ability.
2Manufacturing precision
If high planarization ability is achieved through thermal flow, then the film surface becomes more uniform, but etching resistance may be impaired
Solution Approach 1:
The patent assigns different functional roles to different chemical components within the organic film: silicon-containing compounds provide etching resistance in regions requiring pattern transfer, while aromatic compounds and low molecular weight compounds (200-500) contribute to thermal flow and planarization. This local quality differentiation allows simultaneous achievement of surface uniformity and etching resistance.
Solution Approach 2:
The patent optimizes the molecular weight parameter of specific compounds to the range of 200-500, which provides the ideal balance between thermal flowability for planarization and structural integrity for etching resistance. This precise parameter control enables the film to exhibit both planarization and etching resistance properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The planarizing agent effectively enhances the planarizing ability of organic films, ensuring precise pattern transfer and maintaining etching resistance, suitable for advanced semiconductor processes like three-layer and four-layer resist processes.
Implementation Method 1
the preliminary composition having a complex viscosity of 1.0 Pa·s or more in a temperature range of 175°C or higher, the blended composition has a temperature range in which a complex viscosity of the blended composition is less than 1.0 Pa·s in a temperature range of 175°C or higher
Data Source
Figure 1~2
Figure 3~4(F)
Figure 5(G)~5(I)
AI summary
The present invention is a planarizing agent for forming an organic film, including an aromatic-group-containing compound having a molecular weight represented by a molecular formula of 200 to 500, wherein a blended composition that includes the planarizing agent and a preliminary composition containing an organic film-forming resin and a solvent, and having a complex viscosity of 1.0 Pa·s or more in a temperature range of 175°C or higher has a temperature range in which a complex viscosity of the blended composition is less than 1.0 Pa·s in a temperature range of 175°C or higher. This provides a planarizing agent for forming an organic film to yield a composition for forming an organic film having a high planarizing ability; a composition for forming an organic film containing this planarizing agent; a method for forming an organic film using this composition; and a patterning process.