Array Base Plate Through Parts for Laser Encapsulation Overflow
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Solution Overview
Problem
During the laser encapsulation of display panels, high temperatures cause metal wires to melt and overflow, leading to short circuits between adjacent wires, resulting in poor display performance due to the lack of effective containment mechanisms.
Innovation Solution
An array base plate design featuring a substrate with a first patterned part adjacent to the encapsulation region and a second patterned part in the same layer, where the first patterned part includes through parts such as slots or holes that direct high-temperature overflow away from the second patterned part, preventing material conglutination and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If laser encapsulation is performed at high temperature (over 1200°C), then encapsulation effectiveness is improved, but metal wires melt and overflow causing short circuits
Solution Approach 1:
The first patterned part is segmented by forming through parts (slots or holes) that divide it into multiple regions. This segmentation allows the patterned part to contain overflow material within specific segments while maintaining electrical connectivity through the through parts, resolving the contradiction between high-temperature processing and short circuit prevention
Solution Approach 2:
The through parts act as intermediary structures that serve dual functions: they provide pathways for electrical signals while simultaneously containing overflow material. This intermediary structure enables the system to withstand high temperatures without causing short circuits between adjacent metal wires
2Ease of operation
If metal wires are placed adjacent to encapsulation region, then electrical connectivity is improved, but wires are vulnerable to high temperature damage
Solution Approach 1:
The structure transitions from uniform metal wires to patterned parts with varying local properties. The first patterned part has through parts with different geometries (slots or holes) that provide localized protection against high temperature damage while maintaining electrical connectivity in critical areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The array base plate effectively reduces the risk of material overflow and short circuits between metal wires, improving the yield and reliability of display panels by containing the high-temperature overflow within the designed through parts.
Implementation Method 1
due to the high encapsulating temperature of the laser, which is generally over 1200° C.
Implementation Method 2
it is easy to make the metal wires located in and around the encapsulation region partially overflow due to high temperature melting
Data Source
AI summary
There is provided an array base plate, including: a substrate; a first patterned part disposed on the substrate and adjacent to an encapsulation region of the substrate; a second patterned part disposed on the substrate, in a same layer as the first patterned part and adjacent to the first patterned part; wherein the first patterned part includes a through part on its side close to the second patterned part. There is also provided a manufacturing method for manufacturing the array base plate, and a display panel including the array base plate.