Array Substrate Stepped Via Structure for Bubble-Free Etching
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Solution Overview
Problem
During the manufacturing of array substrates, bubbles generated during the etching process in cross-layer through holes can affect the conductivity of metal layers, leading to reliability and stability issues in the array substrate and subsequent display panels.
Innovation Solution
The array substrate design includes a first metal layer with a laminated portion comprising insulating and conductive layers, and a second laminated portion with a height difference, allowing the etching solution to flow out and reducing bubble formation, ensuring effective contact between metal layers and improving conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If etching is performed to create cross-layer through holes, then metal layers can be connected, but bubbles are generated and remain in the through holes affecting conductivity
Solution Approach 1:
The patent introduces a height difference between the first and second laminated portions, creating a three-dimensional topography that enables etching solution to flow out of the through holes. This dimensional change from a flat surface to a stepped structure allows gravitational drainage of the etching solution, preventing bubble entrapment and improving conductivity reliability.
Solution Approach 2:
The patent performs deposition of insulating and conductive layers in a specific sequence before etching, creating the height difference structure in advance. This preliminary structuring ensures that when etching occurs, the solution has an immediate escape path, preventing bubble formation during the connection process.
2Object-generated harmful factors
If the second laminated portion is extended to reach the edge of the first metal layer, then etching solution can flow out effectively, but the structure becomes more complex
Solution Approach 1:
The patent divides the structure into distinct laminated portions (first and second) with different heights and functions. The second laminated portion is segmented to extend specifically to the edge of the first metal layer, creating a dedicated drainage region that simplifies the overall design by focusing the complexity only where needed for solution evacuation.
3Reliability
If multiple layers are laminated to ensure conductivity, then electrical connection is improved, but manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple functions into the laminated structure: the second laminated portion serves both as an insulating layer and as a drainage channel for the etching solution. The conductive layers are integrated within the laminated portions, merging electrical connection functionality with structural support and fluid evacuation functions, thereby reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the electrical connection and reliability of the array substrate by reducing bubble formation and improving the contact area between conductive and metal layers, thereby stabilizing the array substrate and display panel performance.
Implementation Method 1
a second laminated portion (120) and a first laminated portion (110) are arranged on a side of the first metal layer (102) away from the base substrate (101)... The second laminated portion (120) is extended to reach an edge of the first metal layer (102)... allowing the etching solution to flow out
Implementation Method 2
a conductive layer may be deposited on the second metal layer and the exposed first metal layer to obtain the through holes connecting the first metal layer and the second metal layer
Implementation Method 3
The first via (107) is connected to the first conductive layer (106), the second via (108) is connected to the second conductive layer (111), and the first conductive layer (106) is connected to the second conductive layer (111) to allow the first metal layer (102) to be conductive with the second metal layer (104)
Data Source
AI summary
A base substrate and a first metal layer laminated on the base substrate are included. A first laminated portion and a second laminated portion are arranged on and directly contact a side of the first metal layer. The first laminated portion includes a first insulating layer, a second metal layer, a second insulating layer and a first conductive layer. The first laminated portion is arranged with a first via. The second laminated portion includes a third insulating layer and a second conductive layer laminated on the third insulating layer. The second laminated portion is arranged with a second via. The first via is connected to the first conductive layer, the second via is connected to the second conductive layer, and the first conductive layer is connected to the second conductive layer. The second laminated portion is extended to reach an edge of the first metal layer.