Flexible Array Substrate Buffer Layout for Seamless Screen Splicing
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Solution Overview
Problem
In frameless full-screen splicing displays, the bonding process often results in metal routes breaking due to squeezing, leading to poor display quality as the sides of single array substrates are inevitably compressed, causing physical damage to the signal lines.
Innovation Solution
An array substrate design featuring a flexible base with signal lines, fan-out lines, and buffer cushions, where the buffer cushions are positioned between signal line groups and do not overlap with signal lines, preventing physical damage during splicing by absorbing the stress and reducing the risk of signal line breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding of driving chip on back surface of display panel is performed to realize frameless full screen, then display quality is improved, but signal lines are damaged due to squeezing during the bonding process
Solution Approach 1:
The patent introduces buffer cushions positioned between the signal lines and the bonding area. These buffer cushions absorb the squeezing stress during the bonding process, preventing direct transmission of mechanical stress to the signal lines. This prior cushioning measure protects the signal lines from damage while allowing the bonding operation to proceed for achieving frameless full screen display quality.
2Ease of manufacture
If the sides of single array substrates are compressed during splicing, then splicing is achieved, but metal routes break due to squeezing
Solution Approach 1:
The buffer cushions serve as intermediary elements between the compression force applied during splicing and the metal routes. Instead of directly compressing the metal routes, the compression force is first applied to the buffer cushions, which absorb and distribute the stress. This intermediary mechanism enables splicing to be performed while preventing metal route breakage.
3Reliability
If buffer cushions are added to protect signal lines, then signal line breakage is reduced, but device complexity increases
Solution Approach 1:
The buffer cushions are implemented as thin, flexible protective elements that can be integrated into the existing substrate structure. These thin-film buffer cushions provide the necessary stress absorption capability while adding minimal structural complexity. Their flexible nature allows them to conform to the substrate geometry and be processed using compatible manufacturing techniques, thus protecting signal lines without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer cushions effectively absorb stress during the splicing process, reducing the likelihood of signal line breakage and improving the yield of splicing products by preventing abrasion and squeezing damage, thus enhancing the display quality by minimizing the seam size and maintaining signal line integrity.
Implementation Method 1
The buffer cushions effectively absorb stress during the splicing process, reducing the likelihood of signal line breakage
Data Source
AI summary
The present application discloses an array substrate and a splicing screen. The array substrate provided by an embodiment of the present application includes: a flexible base, wherein the flexible base includes a display region, a first region and a second region, the display region and at least one of the first region and the second region are located in different planes, and the first region is located between the display region and the second region; a plurality of signal lines, arranged on the display region and the first region; a plurality of fan-out lines, arranged on the second region and connected with the plurality of signal lines in a one-to-one correspondence; and a buffer cushion, arranged on the first region, wherein an orthographic projection of the buffer cushion on the flexible base does not overlap with orthographic projections of the signal lines on the flexible base.