Identification Means TRIZ Cases

Stacked encapsulation layers are cured and thinned to form LED panel openings, cutting molding, baking, and etching steps.

A hydrophobic protective layer blocks black light-shielding spread, improving anti-reflection while preserving luminous flux.

Shifting the die long side away from <110> and using laser-absorbing bonding helps AlGaInP micro-LEDs avoid cracking during LLO transfer.

Grooves in the gate insulating film guide and stop cracks, preventing control line and wiring breaks in display regions.

Parallel bonding of a micro LED semiconductor layer and via interconnects cuts transfer time, reduces connection defects, and improves display yield.

Imprinting a low refractive layer shapes the color conversion material in a micro LED display to improve optical efficiency, contrast, and response time.

Wafer-level bonding and a light-shielding layer cut micro LED transfer time, prevent circuit light interference, and improve yield.

A wavelength selection layer blocks harmful curing beams near conductive wires, limiting material deterioration and improving display reliability.

A temporary scratch-resistant layer shields Mini LED substrate circuits during solder paste printing, then is laser stripped to preserve function.

A photoresist passivation layer fills gaps in inorganic LED substrates to prevent cracking and leakage while simplifying fabrication.

A reflective film and higher-index light-transmitting wall redirect micro LED side emission to boost brightness and reduce external reflection.

Varying bump thickness fills the LED chip step portion to prevent voids and creep fractures while improving mounting stability and light extraction.

A wavelength selection layer blocks curing energy beams near conductive wires and conversion layers, preserving display quality and reliability.

A layered flexible color filter reflects and diffuses blue light to boost quantum dot absorption, raising output ratio and color purity.

Asymmetric pad areas and solder volumes limit voids during LED bonding while preventing component tilt and unstable electrical connection.

A TMD monolayer on a GaN LED uses ion-defined emission regions to improve single-photon quality while avoiding complex optical alignment.

Alignment marks in the bank portion enable real-time inkjet position correction, preventing color conversion layer misplacement in OLED displays.

Pre-formed main and sub-marks help inspectors quickly identify dense display panel connection lines and speed panel inspection.

Silicide alloy electrodes avoid exposure-based misalignment from bowed growth substrates, improving micro-LED transfer, efficiency, and power use.

Buffer cushions placed between signal lines absorb splicing stress, preventing route breakage and preserving display quality in frameless screens.

Stacked metal traces across bridge layers narrow display panel connection regions, improving bending resistance and reducing fracture risk.

An elastic connecting region with recessed light-emitting areas enables large stretch deformation while limiting optical interference.

Pivoting display panels turn cable conveyance structures into cable enclosures that also show public information and ads while preserving maintenance access.

Interlocking protrusions and grooves strengthen OLED auxiliary cathode layers, improving luminous quality, bending reliability, and service life.

A bridge portion links spaced metal patterns to block edge corrosion in display alignment lines and preserve electrical continuity.

A deformation layer locally thins the cathode in the under-screen area, balancing light transmission with normal display quality.

Transparent and reflective electrodes with insulation between light-emitting rods simplify transfer to driving circuits while improving light extraction.

A shielding layer blocks electric-field interference between signal lines and pixel circuits, enabling stable under-screen sensing and full display use.

Backside routing of scanning and data lines cuts frame width, avoids line scratching, and improves seamless M-LED splicing yield.

Dual light-emitting elements and a light-guiding structure keep Mini LED display output continuous when one lamp bead emitter fails.

Removing or partially covering the epitaxial growth substrate reduces light interference and improves display effect in light-emitting modules.

Isolated insulating portions around adjacent transistors reduce stress on connecting wires, improving flexible device reliability on curved surfaces.

A light transmitting area inside the display houses cameras and sensors, while an inorganic film maintains transmittance and blocks moisture.

A capping layer shields tiled display pad electrodes during etching, lowers contact resistance, and helps reduce visible seams between modules.

A strain-relaxed undoped semiconductor layer relieves active-layer stress, limiting defects and indium aggregation while preserving luminous efficiency.

A nested gate insulator and smaller gate layout blocks plasma diffusion into the channel, preserving channel length and threshold voltage.

Bank protrusions increase the electron path between adjacent subpixels, blocking lateral leakage current and preserving color reproduction.

Microlens rotation-matched slit patterns improve OLED light extraction, cut subpixel light leakage, and raise luminance with lower power.

A stacked substrate layout places connecting leads near the neutral layer to reduce bend stress, improving foldable OLED panel yield and reliability.

A detachable frame with insert portions and studs improves torque resistance, surface flatness, and heat dissipation in tiled micro-LED modules.

Varying current-spreading layer widths by wavelength improves RGB luminance balance and luminous efficiency in light-emitting displays.

A shared color conversion layer across tiled panels improves display visibility and simplifies alignment and manufacturing.

Lens-like light-transmitting patterns improve display light output while avoiding the thickness and poor bendability of whole-layer structures.

An oxide transistor layer linked to single-crystal silicon cuts leakage current, enabling low-frequency OLED driving without flicker.

Upper light-blocking coverage over overlapping color filters cuts external-light reflection and diffraction without a polarizer.

Inorganic overhangs enable lift-off-free OLED sub-pixel deposition, reducing particle defects while improving pixel density and throughput.

A semielliptical bending portion cuts bezel size while lowering wire stress and preserving drop and compression strength.

Lower-modulus sub-portions fill gaps between rigid pixel regions, helping curved display panels deform smoothly without overlap or abnormal display.

Separated heat dissipation structures isolate heat sources from the panel, cutting hotspots, yellowing, and EMI in vehicle displays.

Dual-viscosity adhesive fills edge chamfers to prevent bubbles, improve encapsulation yield, and reduce warping in narrow-bezel panels.

Selective micro lenses above micro-LEDs boost transparent display brightness while limiting external light scattering and preserving transparency.

Light-shielding openings and powered bus connections let front sensors work beneath the display while preserving active screen area.

Independent emitters and a shared light guide let a lamp bead switch to a standby element after failure while keeping uniform display output.

Grooves in the insulating layer hold inkjetted light-shielding material, preventing creep onto microLED emitters and preserving light output.

Segmented removal areas let the protective film detach cleanly from the reinforcement member, reducing damage risk in OLED display assembly.

Hollowed-out inorganic and organic packaging layers protect stretchable display openings from cracking while preserving sealing and flexibility.

Inorganic light-emitting panels extend pixels closer to panel edges, reducing visible seams while protecting transistors.

Anode and cathode signal lines are routed from opposite ends to limit IR-drop effects and keep brightness consistent across large OLED displays.