Mini LED Substrate Scratch-Resistant Layer for Solder Paste Printing
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Solution Overview
Problem
The circuit on the Mini LED substrate in traditional solder paste printing processes is easily damaged due to high contact forces, leading to short-circuits and functionality issues.
Innovation Solution
A method of manufacturing a substrate that involves forming a scratch-resistant layer on the substrate, patterning it to create a via hole, filling solder paste into the via hole, and then stripping the scratch-resistant layer to prevent circuit damage during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional screen printing with scrapers is used to print solder paste, then the solder paste can be printed on the substrate, but the high contact force causes circuit damage and short-circuits
Solution Approach 1:
A scratch-resistant layer is formed on the substrate before the screen printing process. This preliminary protective layer prevents the pixel driving circuit from being damaged by the high contact force of the scrapers during solder paste printing, while allowing the printing process to proceed normally
Solution Approach 2:
The scratch-resistant layer acts as an intermediary between the scraper and the pixel driving circuit. It absorbs and distributes the contact force during screen printing, protecting the underlying circuit from direct mechanical damage while still allowing the solder paste to be printed through the mesh
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The scratch-resistant layer protects the pixel driving circuit from damage during solder paste filling, and its subsequent removal ensures that the circuit is not crushed, maintaining the substrate's functionality and performance.
Implementation Method 1
step of the stripping the scratch-resistant layer comprises irradiating the scratch-resistant layer by an excimer laser used as a light source to strip off the scratch-resistant layer
Data Source
AI summary
A substrate and a method of manufacturing thereof. A scratch-resistant layer is formed before filling the solder paste in the area corresponding to the binding terminal of the light-emitting device on the substrate, so that each circuit in the drive circuit area of the substrate will not be damaged during screen printing. After filling solder paste, the scratch-resistant layer is stripped off to prevent the circuit on the substrate from being damaged, without affecting the performance of the substrate.