Silicide Alloy Micro-LED Electrodes for Substrate Bowing Defects
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Solution Overview
Problem
The manufacturing of micro-LED display apparatus is hindered by defects caused by the bowing phenomenon of growth substrates, leading to positional biases and size inconsistencies in electrode formation, resulting in operational defects such as non-emitting light areas on the display.
Innovation Solution
A light-emitting device with a nitride semiconductor structure, including a first and second semiconductor layer, an active layer, and electrodes formed using a silicide alloy process without an exposure step, which reduces the number of process steps and secures alignment, thereby minimizing defects and enhancing transferability to panel substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an exposure process is used to form pad electrodes, then alignment precision can be achieved, but the total number of process steps increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the exposure process from the manufacturing flow by using a direct patterning method where the pad electrode pattern is formed through selective deposition or self-alignment mechanisms, removing the need for photoresist coating, exposure, and development steps while maintaining alignment precision through alternative means
Solution Approach 2:
The pad electrode pattern is prepared in advance through preliminary structuring of the substrate or previous layers, allowing subsequent electrode formation to align automatically with pre-defined pattern regions, thereby eliminating the need for exposure-based alignment while reducing total process steps
2Area of stationary object
If micro-LEDs are transferred to panel substrates, then large-area display can be achieved, but contact resistance between pad electrodes increases power consumption
Solution Approach 1:
The patent changes the electrical parameters of the pad electrode interface by modifying material composition, layer structure, or surface properties to reduce contact resistance, thereby lowering power consumption in large-area tiled displays while maintaining the scalability benefit of modular transfer
3Productivity
If growth substrates are used for micro-LED fabrication, then manufacturing efficiency can be improved, but bowing phenomenon causes positional biases and size inconsistencies in electrodes
Solution Approach 1:
The patent applies preliminary counter-actions to compensate for substrate bowing effects, such as pre-distorting the substrate or applying compensatory forces during processing, to prevent positional biases and size inconsistencies in electrode formation while maintaining high manufacturing efficiency through batch processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silicide alloy electrodes with low work function and resistance increase current injection, enhancing luminous efficiency and reducing power consumption, while optimizing the manufacturing process by eliminating the exposure step and addressing bowing-related defects.
Implementation Method 1
The silicide alloy electrodes with low work function and resistance increase current injection, enhancing luminous efficiency
Data Source
AI summary
A light-emitting device, display apparatus including the same and method for manufacturing the device and apparatus are disclosed. The light-emitting device includes a nitride semiconductor structure including a first semiconductor layer, an active layer and a second semiconductor layer; a passivation pattern disposed on an outer surface of the nitride semiconductor structure; a first electrode connected to the first semiconductor layer; and a second electrode spaced apart from the first electrode and connected to the second semiconductor layer, wherein each of the first electrode and the second electrode includes a silicide alloy. Accordingly, the defect in manufacturing the electrode of the light-emitting device due to the bowing phenomenon of the growth substrate may be removed.