Flexible Electronic Layout With Isolated Insulation for Stretchability
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Solution Overview
Problem
Existing flexible electronic devices face challenges in reliability and stretchability due to stress on connecting portions and conductive wires when deformed, leading to potential breakage and reduced performance on curved surfaces.
Innovation Solution
A manufacturing method for flexible electronic devices involves patterning an insulating layer into isolated portions and a flexible substrate with specific layer structures, including transistors and conductive wires, to reduce stress on connecting portions and improve reliability and stretchability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible electronic device is stretched or bent to attach to curved surfaces, then the device can be fixed to curved surfaces such as skin or car panels, but stress concentrates on connecting portions and conductive wires leading to potential breakage and reduced reliability
Solution Approach 1:
The insulating layer is divided into multiple isolated insulating portions, each covering different transistor components. This segmentation allows the connecting portions between transistors to be free from insulating material, reducing stress concentration during stretching or bending operations and preventing breakage of conductive wires.
Solution Approach 2:
Different regions of the device are given different properties: the insulating portions are located only under the transistor active areas, while the connecting portions between transistors have no insulating layer coverage. This local differentiation reduces stress on connecting portions during deformation while maintaining insulation where needed.
2Reliability
If a continuous insulating layer is used to cover all transistor components, then complete insulation is achieved, but stress on connecting portions increases during deformation reducing stretchability
Solution Approach 1:
The insulating layer is segmented into multiple isolated insulating portions rather than forming a continuous layer. Each insulating portion covers specific transistor components, while gaps between these portions leave the connecting portions exposed, allowing the device to stretch without excessive stress concentration.
Solution Approach 2:
The insulating structure is designed to be dynamic rather than static - the isolated insulating portions allow the device to adapt its insulation coverage during deformation, maintaining insulation reliability when needed while permitting stretchability when the device is bent or stretched for attachment to curved surfaces.
Data Source
AI summary
A manufacturing method of a flexible electronic device includes providing a carrier substrate, forming a first layer on the carrier substrate, forming an insulating layer on a first surface of the first layer, forming a plurality of transistors on the insulating layer, wherein the plurality of transistors include at least one first transistor and at least one second transistor, patterning the insulating layer into a plurality of first portions, wherein the at least one first transistor and the at least one second transistor are respectively disposed on two adjacent ones of the plurality of first portions, removing the carrier substrate, and attaching a flexible substrate to a second surface of the first layer opposite to the first surface. The two adjacent ones of the plurality of first portions are isolated from each other.