LED Display Encapsulation Layout for Faster Panel Manufacturing
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Solution Overview
Problem
The manufacturing process of LED display panels is labor-intensive, time-consuming, and costly due to the need for individual molding, hard baking, and etching processes in forming encapsulation patterns.
Innovation Solution
A simplified manufacturing method involving the use of a laminated encapsulation device with stacked encapsulation material layers that are cured and then thinned down to form encapsulation patterns, reducing the need for multiple processes and simplifying the encapsulation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If individual molding, hard baking and etching processes are used for each encapsulation pattern, then the encapsulation patterns can be formed with precise control, but the manufacturing process becomes labor-intensive, time-consuming and costly
Solution Approach 1:
The patent merges multiple separate encapsulation patterns into a single integrated encapsulation layer. Instead of forming each encapsulation pattern individually through separate molding, hard baking, and etching processes, the invention uses one-time molding and hard baking to create a unified encapsulation layer that provides the same protective and structural functions, thereby dramatically reducing manufacturing steps and improving productivity while maintaining precision
Solution Approach 2:
The unified encapsulation layer serves multiple functions simultaneously: it provides structural support, protects the light emitting devices, defines the display region, and creates the necessary patterns all in a single component. This multi-functional approach eliminates the need for multiple separate encapsulation patterns and their associated manufacturing processes
2Adaptability or versatility
If multiple separate encapsulation patterns are formed individually, then each pattern can be optimized independently, but the overall manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent combines multiple encapsulation patterns into a single unified encapsulation layer that is formed through one-time molding and hard baking. This integration maintains the functional advantages of having patterned encapsulation while eliminating the complexity of forming and processing multiple separate patterns through individual molding, hard baking, and etching steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing steps, decreases labor and time consumption, and minimizes residue cleaning difficulties while enhancing light emission efficiency and visual effects of the display apparatus.
Implementation Method 1
The first encapsulation material layer and the second encapsulation material layer are cured to form a first encapsulation layer and a second encapsulation layer
Data Source
AI summary
A display apparatus includes a driving backplane, a plurality of light emitting devices, a first encapsulation pattern, and a second encapsulation pattern. The light emitting devices are disposed on the driving backplane and electrically connected to the driving backplane. The first encapsulation pattern includes a first portion and a second portion. The first portion is disposed on the driving backplane. The second portion is disposed on the first portion of the first encapsulation pattern, covers a plurality of sidewalls of the light emitting devices, and has a plurality of first openings overlapping a plurality of top surfaces of the light emitting devices. The second encapsulation pattern is disposed on the first portion of the first encapsulation pattern and has a plurality of second openings. The second openings are overlapped with the top surfaces of the light emitting devices and the second portion of the first encapsulation pattern.