Hollowed-Out Display Packaging Layers for Stretchable Crack Resistance
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Solution Overview
Problem
Flexible stretchable display panels face challenges with inorganic packaging layers prone to cracking in opening regions during stretching due to the lack of structural support and protection.
Innovation Solution
A display panel design featuring a base substrate with island and bridge regions, an inorganic packaging layer with a hollowed-out structure, and an organic packaging layer with a corresponding hollowed-out structure, along with isolation grooves to enhance sealing and protect the inorganic layer, ensuring stretchability and reducing cracking risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic packaging layer is provided continuously over the opening region, then sealing performance is improved, but the layer becomes prone to cracking during stretching due to lack of structural support
Solution Approach 1:
The inorganic packaging layer is divided into multiple separate regions corresponding to different pixel islands, with gaps between them. This segmentation allows each region to independently support its underlying structure without transmitting stress across the opening region, preventing crack propagation while maintaining local sealing effectiveness.
Solution Approach 2:
The inorganic packaging layer is strategically positioned only over regions requiring sealing (pixel islands) while being removed from areas requiring flexibility (opening regions). This local quality approach provides sealing where needed while maintaining structural flexibility and crack resistance where the layer is absent.
2Adaptability or versatility
If the inorganic packaging layer is removed from the opening region to prevent cracking, then stretchability is improved, but sealing performance deteriorates
Solution Approach 1:
The packaging structure is segmented into inorganic regions for sealing and organic-only regions for flexibility. The inorganic packaging layers over adjacent pixel islands are positioned to extend toward but not bridge across the opening region, creating isolated sealing zones that maintain effectiveness without compromising overall stretchability.
Solution Approach 2:
The packaging structure combines inorganic and organic materials in a composite arrangement, where inorganic layers provide sealing over pixel regions and organic layers provide flexibility over opening regions. This composite approach allows each material to perform its optimal function in the appropriate location.
3Strength
If multiple packaging layers are added to enhance protection, then crack resistance is improved, but device complexity increases
Solution Approach 1:
Instead of adding multiple continuous layers that would increase complexity, the solution segments the inorganic packaging into discrete regions. This segmentation achieves crack resistance through strategic positioning and spacing of layers, avoiding the need for complex multi-layer configurations while maintaining protective functionality.
Solution Approach 2:
The inorganic packaging material is extracted from regions where it would create complexity and potential crack points (opening regions), while being retained in regions where it provides necessary sealing and protection (pixel island regions). This selective extraction simplifies the overall structure by removing unnecessary material.
Data Source
AI summary
Disclosed are a display panel, a display device, and a manufacturing method. The display panel includes: a base substrate including multiple island regions, an opening region, and a bridge region, each of the island regions having at least one pixel; an inorganic packaging layer on a side of the base substrate, the inorganic packaging layer covering the island regions and the bridge regions and having a first hollowed-out structure, and the orthographic projection of the first hollowed-out structure on the base substrate covering the orthographic projection of the opening regions on the base substrate; and an organic packaging layer located on the side of the inorganic packaging layer facing away from the base substrate and having a second hollowed-out structure, the orthographic projection of the second hollowed-out structure on the base substrate covering the orthographic projection of the first hollowed-out structure on the base substrate.