LED Display Bonding Layout for Void-Free Solder Joints
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Solution Overview
Problem
The manufacturing process of LED display panels often results in voids forming in the solders due to the uneven semiconductor structure of LED components, affecting the reliability of the display apparatus, and increasing downward force to prevent voids can lead to tilting of the components.
Innovation Solution
A display apparatus design featuring a driving backplane with specific pad configurations and light emitting components where the first solder has a larger volume than the second solder, and the first pad has a smaller area than the second pad, minimizing void formation by controlling solder spreading during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If downward force is increased during bonding to reduce voids, then solder void formation is reduced, but LED component tilting occurs
Solution Approach 1:
The patent applies different pad areas to different electrodes: the first pad (corresponding to the first electrode) has a larger area than the second pad (corresponding to the second electrode). This local differentiation allows the solder to spread more on the first pad, filling recesses effectively, while the smaller second pad prevents excessive solder flow that could cause tilting. Each pad is optimized locally for its specific function.
Solution Approach 2:
The patent changes the geometric parameters of the pads, specifically making the area of the first pad larger than the area of the second pad. This parameter change creates an asymmetric solder spreading pattern that compensates for the uneven semiconductor structure, allowing better void elimination without requiring excessive bonding force that would cause tilting.
2Reliability
If pad area is increased to accommodate larger solder volume, then void formation is reduced, but overall device area increases
Solution Approach 1:
Instead of uniformly increasing all pad areas, the patent applies local quality differentiation where only the first pad has a larger area to accommodate the larger first solder volume. The second pad maintains a smaller area corresponding to the smaller second solder volume. This localized approach ensures reliable solder connections where needed while minimizing the overall area increase of the driving backplane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the LED display apparatus by reducing the likelihood of voids in the solders and preventing tilting of the components, ensuring a stable electrical connection.
Implementation Method 1
A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad
Data Source
AI summary
A display apparatus includes a driving backplane and a light emitting component. The driving backplane has a first pad and a second pad. The light emitting component is disposed on the driving backplane. The light emitting component includes a first semiconductor layer, a second semiconductor layer, an active layer, a first electrode, a second electrode, a first solder and a second solder. The first solder and the second solder of the light-emitting component are respectively disposed on the first pad and the second pad of the driving backplane and electrically connected to the first pad and the second pad respectively. A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad.