Wavelength-Filtered Conductive Wire Layout for Curing Protection

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Solution Overview

Problem

Existing electronic devices face challenges in improving the reliability and display quality, particularly due to the impact of energy beams used in curing processes which can deteriorate certain components.

Innovation Solution

The electronic device incorporates a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, which blocks energy beams to protect sensitive materials and enhance the device's reliability and display quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If energy beams are used in curing processes, then curing efficiency is improved, but component deterioration increases

Engineering Contradiction:
Improvecuring efficiencyVSAvoidcomponent deterioration
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A wavelength selection layer is introduced as an intermediary component between the energy beam source and the components to be cured. This layer selectively transmits specific wavelengths needed for curing while blocking harmful wavelengths that cause deterioration, thus mediating between the curing process and component protection requirements

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the spectral parameters of the energy beam by using a wavelength selection layer with specific optical properties. The layer is designed to transmit only certain wavelength ranges that are effective for curing while absorbing or reflecting wavelengths that would cause damage to sensitive components

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If wavelength selection layer is added, then component protection is improved, but device complexity increases

Engineering Contradiction:
Improvecomponent protectionVSAvoiddevice complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The wavelength selection layer is implemented as a thin film structure that can be integrated into the existing device architecture. This thin film approach provides the necessary wavelength filtering functionality while minimizing the additional space and structural complexity required

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The wavelength selection layer serves multiple functions simultaneously: it acts as a wavelength filter for curing, provides component protection, and can also serve as part of the overall device structure. This multi-functionality reduces the need for separate protective components, thereby limiting the increase in device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wavelength selection layer effectively suppresses energy beam transmittance to less than 10%, thereby reducing component deterioration and improving the overall reliability and display quality of the electronic device.

Implementation Method 1

a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, which blocks energy beams to protect sensitive materials

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Data Source

PatentUS20250056950A1Electronic device
Publication Date: 2025.02.13 INNOLUX CORP
  • US20250056950A1 patent drawing
  • US20250056950A1 patent drawing
  • US20250056950A1 patent drawing

AI summary

An electronic device includes a first substrate, a second substrate, a circuit layer, a diode element, and a conductive wire. The first substrate has a first surface, a second surface opposite to the first surface, and a first side surface connected between the first surface and the second surface. The second substrate has a third surface, a fourth surface opposite to the third surface, and a second side surface connected between the third surface and the fourth surface, wherein the fourth surface is disposed away from the first surface. The circuit layer and the diode element are disposed on the first surface. The diode element and the conductive wire are electrically connected to the circuit layer. A first portion of the conductive wire is disposed on the first side surface, and a second portion of the conductive wire is disposed on the second side surface.