Display Panel Backside Line Layout for Seamless M-LED Splicing
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Solution Overview
Problem
Current M-LED splicing methods, relying on side printed lines or side physical vapor deposition, face challenges such as high manufacturing costs, difficulty in achieving seamless splicing, and low yield due to easily scratched line structures during the splicing process.
Innovation Solution
The display panel design includes a substrate with a driving circuit layer, light-emitting units, scanning lines, and data lines arranged on the substrate's side, with a buffer layer and encapsulation layer to manage stress and surface roughness, and vias for electrical connections, allowing for the transfer of scanning and data lines to the substrate's side to avoid the issues of large frame width and scratching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If side printed lines or side PVD film-formation are used for M-LED splicing, then the splicing can be achieved, but the line structures are easily scratched during splicing process resulting in low yield
Solution Approach 1:
The patent inverts the conventional approach by moving the scanning lines and data lines from the side of the display panel to the back side of the substrate. This inversion eliminates the exposure of line structures during splicing, preventing scratching and improving yield.
Solution Approach 2:
The patent extracts the scanning lines and data lines from the display panel side and relocates them to the back side of the substrate. This separation removes the vulnerable line structures from the splicing area, eliminating the scratching problem.
2Reliability
If side printed lines or side PVD film-formation are used for M-LED splicing, then the connection can be established, but the manufacturing cost is high and seamless splicing is difficult to achieve
Solution Approach 1:
By inverting the location of scanning lines and data lines to the back side of the substrate, the patent enables seamless splicing without visible line structures on the display panel side, while simplifying the manufacturing process.
Solution Approach 2:
The patent moves the line structures from the two-dimensional display panel surface to the third dimension (back side of substrate), eliminating their visual impact and simplifying the splicing process.
3Reliability
If scanning lines and data lines are formed on the side of the display panel, then the electrical connection is established, but the frame width becomes large
Solution Approach 1:
The patent extracts the scanning lines and data lines from the display panel side and relocates them to the back side of the substrate, removing them from the visible frame area and reducing frame width.
Solution Approach 2:
By relocating the line structures to the back side of the substrate (another dimension), the patent eliminates their contribution to the visible frame width while maintaining electrical connection functionality.
Data Source
AI summary
The present application provides a display panel, a manufacturing method thereof, and a splicing display device. The display panel includes: a substrate; a driving circuit layer, and the driving circuit layer includes a plurality of thin film transistors; light-emitting units; and a plurality of scanning lines and a plurality of data lines disposed on a side of the substrate away from the driving circuit layer. The display panel comprises a plurality of display areas, and each of the display areas is provided with one of the light-emitting units and one of the thin film transistors electrically connected to the one of the light-emitting units, one of the scanning lines, and one of the data lines, respectively.