Micro LED Display Bonding and Via Interconnect for Faster Transfer
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Solution Overview
Problem
The existing methods for manufacturing image display devices using micro LEDs are time-consuming and prone to connection defects, leading to reduced yield and high costs, especially as the number of micro LEDs increases with higher image quality requirements.
Innovation Solution
The proposed method involves preparing a second substrate with a semiconductor layer grown on a first substrate, bonding this layer to a third substrate with a circuit element and wiring layer, forming a light-emitting element, and then electrically connecting it to the circuit element through a via, with the wiring layer including a light-reflective part to enhance luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individually-formed micro LEDs are sequentially transferred to a drive circuit substrate, then connection between light-emitting elements and drive circuits is achieved, but the transfer process becomes extremely time-consuming and connection defects increase
Solution Approach 1:
The patent merges multiple micro LED chips and their corresponding drive circuits onto a single substrate simultaneously, rather than transferring them individually. This is achieved by forming a semiconductor layer containing multiple light-emitting elements on a first substrate, bonding this layer to a drive circuit substrate containing multiple drive circuits, and then separating the substrates to establish connections. This merging approach dramatically reduces transfer time and minimizes connection defects compared to sequential individual transfer.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the semiconductor layer with multiple micro LED chips on a first substrate before bonding it to the drive circuit substrate. The drive circuits are also pre-formed on the substrate. This preliminary preparation allows for simultaneous connection of multiple light-emitting elements to their corresponding drive circuits in a single bonding step, significantly improving productivity while maintaining connection quality.
2Manufacturing precision
If the number of micro LEDs is increased to achieve higher image quality such as full high definition, 4K, 8K, then image resolution is improved, but the transfer process time increases enormously and yield decreases
Solution Approach 1:
The patent merges a large number of micro LED chips with their corresponding drive circuits onto a single substrate in parallel, rather than transferring them individually. By forming a semiconductor layer containing multiple light-emitting elements on a first substrate and bonding it to a drive circuit substrate containing multiple drive circuits, the system achieves high image resolution (full HD, 4K, 8K) without proportionally increasing transfer time, as all connections are established simultaneously in a single bonding step.
3Reliability
If individually-formed micro LEDs are transferred sequentially to a substrate with drive circuits, then each light-emitting element can be connected to its drive circuit, but the manufacturing cost increases due to reduced yield and extended process time
Solution Approach 1:
The patent merges multiple micro LED chips and drive circuits onto a single substrate simultaneously through a single bonding process. By forming a semiconductor layer containing multiple light-emitting elements on a first substrate and bonding it to a drive circuit substrate containing multiple drive circuits, then separating the substrates, the system achieves high connection reliability while significantly reducing manufacturing costs through improved yield and reduced process time compared to sequential individual transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly shortens the transfer process of light-emitting elements and increases yield, reducing the time and cost associated with manufacturing high-quality image display devices with higher image resolution.
Implementation Method 1
a process of bonding the semiconductor layer to the third substrate
Implementation Method 2
The wiring layer includes a part that is light-reflective. The light-emitting element is located on the part.
Data Source
AI summary
A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a light-transmitting substrate, a circuit element formed on the light-transmitting substrate, a wiring layer connectable to the circuit element, and a first insulating film covering the circuit element and the wiring layer; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the light-emitting element; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via. The wiring layer includes a light-reflective part. The light-emitting element is located on the light-reflective part.