Array Substrate Concave Lateral Surface for Narrow Frame
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Solution Overview
Problem
Existing display technologies face challenges in creating ultra-narrow frame designs due to the fragility of silver glue electrodes when directly applied to the lateral surface of array substrates during assembly, leading to potential damage and electrical connection issues.
Innovation Solution
The implementation of a concave portion on the lateral surface of the array substrate, where leads extend to the edge, and an electrode is placed within this concave portion to securely connect with the leads, transferring the bonding region to the lateral or back surface to reduce frame width and protect the electrode from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silver glue electrode is directly applied to the lateral surface of array substrate, then electrical connection is achieved, but the electrode is fragile and prone to damage during assembly
Solution Approach 1:
The electrode is moved from the lateral surface to the back surface of the array substrate, changing the dimensional position of the bonding region. This allows the electrode to be formed on a more stable surface that is not exposed during assembly, thereby protecting it from damage while maintaining electrical connection functionality
Solution Approach 2:
The electrode is formed on the back surface before the assembly process, and the back surface is then used as the bonding surface. This preliminary positioning of the electrode on a protected surface prevents subsequent damage during assembly operations
2Reliability
If bonding region is located on the front surface of array substrate, then electrical connection is established, but the frame width increases
Solution Approach 1:
The bonding region is relocated from the front surface (X-Y plane) to the back surface of the array substrate, utilizing the Z-dimension (depth) to reposition the electrode. This dimensional transition allows the frame width to be reduced while maintaining electrical connection integrity
Solution Approach 2:
Instead of extending the bonding region forward from the lateral surface, the patent inverts the approach by placing the bonding region on the back surface, reversing the conventional spatial arrangement to achieve ultra-narrow frame design
Data Source
AI summary
An array substrate, a display panel and a manufacturing method thereof are provided. The array substrate includes a base substrate including a peripheral region; and a lead region located in the peripheral region, the lead region including a plurality of leads, wherein a main plane of the base substrate provided with the plurality of leads includes a first side edge, and the plurality of leads extend to the first side edge, a lateral surface of the base substrate at the first side edge is provided with a concave portion, and an electrode electrically connected with the plurality of leads is disposed in the concave portion.