Array Substrate Conductive Layer Adhesion via Segmented Metal Design
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Solution Overview
Problem
Conventional mini-LED backlight modules face manufacturing complexities due to poor adhesion between the MoTiNi alloy layer and solder paste, leading to weak bonding of the mini-LED and oxidation of the copper layer.
Innovation Solution
A fabrication method involving a first conductive layer and a second conductive layer on a substrate, where the second conductive layer is used to prevent oxidation of the first conductive layer, with improved adhesion between the connection member and the conductive electrode, using materials like Cu, Mo, and MoTiNi alloy to enhance bonding and oxidation resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the MoTiNi alloy layer is used to prevent oxidation of the copper layer, then oxidation resistance is improved, but adhesion between the conductive layer and solder paste deteriorates
Solution Approach 1:
The conductive layer is divided into two separate layers: a copper layer (first conductive layer) for electrical conductivity and a MoTiNi alloy layer (second conductive layer) for oxidation protection. By segmenting the functions into separate layers rather than using a single material, the patent achieves both high electrical conductivity and oxidation resistance while maintaining good adhesion to solder paste through the copper surface.
Solution Approach 2:
Different regions of the conductive structure have different material compositions optimized for their specific functions. The copper layer provides excellent electrical conductivity and solder paste adhesion where needed, while the MoTiNi alloy layer provides oxidation protection in regions exposed to oxidizing environments. This local differentiation of material properties resolves the contradiction between oxidation resistance and adhesion.
2Device complexity
If the second metal pattern layer simultaneously forms conductive structure and conductive electrode, then manufacturing process complexity is reduced, but adhesion between connection member and conductive electrode deteriorates
Solution Approach 1:
The patent segments the conductive structure into distinct first and second conductive layers with different functions. The first conductive layer (copper) is optimized for electrical conductivity and adhesion to connection members like solder paste, while the second conductive layer (MoTiNi alloy) provides oxidation protection. This segmentation maintains manufacturing simplicity while ensuring reliable bonding through the copper layer's superior adhesion properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method simplifies the manufacturing process, improves adhesion, and ensures robust bonding of the light-emitting element on the array substrate by enhancing oxidation resistance and adhesion between the conductive layers.
Implementation Method 1
the second conductive layer is used to prevent oxidation of the first conductive layer
Implementation Method 2
adhesion between the first conductive layer and the connection member is greater than adhesion between the second conductive layer and the connection member
Data Source
AI summary
An array substrate, a fabrication method thereof, and a display device are provided. The fabrication method includes forming a first conductive layer and a second conductive layer on both of a first area and a second area of a substrate; forming a bonding pin in the first area to electrically connect with a driving chip, wherein the second conductive layer is located at a side of the first conductive layer away from the substrate; and removing the second conductive layer in the second area, forming a conductive electrode in the second area to electrically connect with a light-emitting element by a connection member.