Corrosion-Resistant Connection Wiring for Array Substrates
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Solution Overview
Problem
The existing manufacturing methods for display devices face challenges such as discharge breakdown due to static electricity, leading to short circuits or corrosion of metal wiring, which reduces the number of usable display panels from a mother substrate and affects the reliability of the devices, especially under high temperature and humidity conditions.
Innovation Solution
An array substrate configuration is developed with connection wirings formed in a corrosion-resistant conductive layer, intersecting the cutting line to connect external-connection terminals with a common wiring in adjacent panels, and a method to fabricate display panels by bonding substrates with a gap, cutting, and separating them to maximize the number of panels obtained while enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If connection wirings are formed from the same layer as scan wirings or signal wirings using low resistance metal film, then electrical conductivity is improved, but corrosion resistance deteriorates under high temperature and humidity conditions
Solution Approach 1:
The patent applies different material properties to different parts of the wiring system. Connection wirings that intersect the cutting line are formed from corrosion-resistant conductive layers (second or third conductive layers), while other wirings can use low-resistance metal films. This local differentiation allows each wiring to have the appropriate properties for its specific function and location.
Solution Approach 2:
The patent employs a multi-layer conductive structure where connection wirings are formed by combining multiple conductive layers with different properties. The composite structure integrates the corrosion resistance of outer layers with the electrical conductivity of inner layers, achieving both requirements simultaneously in the connection wirings.
2Productivity
If the array substrate is cut along the cutting line to separate display panels, then individual display panels are obtained, but connection wirings intersecting the cutting line become exposed and susceptible to corrosion
Solution Approach 1:
The patent identifies connection wirings that intersect the cutting line as a special category requiring different material properties. These specific wirings are formed from corrosion-resistant conductive layers, while other wirings in the array can use standard low-resistance metal films. This localized treatment protects only the vulnerable connection wirings without affecting other areas.
Solution Approach 2:
The patent applies corrosion-resistant conductive layers to connection wirings before the cutting process occurs. This preliminary protective measure ensures that when the substrate is later cut and connection wirings become exposed, they are already protected against corrosion from the outset, eliminating the need for post-cutting protection.
3Reliability
If external static electricity causes discharge breakdown, then short circuits or breaks occur in scan wirings or signal wirings, but providing anti-static short wirings reduces the number of usable display panels
Solution Approach 1:
The patent provides anti-static protection only in specific locations where connection wirings intersect the cutting line, rather than implementing a comprehensive anti-static network across the entire array substrate. This localized approach protects vulnerable areas from discharge breakdown while minimizing the area lost to anti-static structures, thereby maintaining higher productivity.
Data Source
AI summary
An array substrate comprises on an insulative substrate, a plurality of display areas to be portions of a plurality of display panels, in which, each display area is constituted with a plurality of pixels arranged in a matrix, and the pixels is constituted with pixel electrodes formed at intersection portions of plural scan wirings and plural signal wirings; a common wiring is formed outside each display area, for applying a reference voltage to the pixels; a plurality of external-connection terminals is formed outside each display area, to be connected with a driver circuit that drives; and comprises connection wirings located so as to intersect a cutting line along which the insulative substrate is to be cut, for connecting the external-connection terminals in one of the display panels on the insulative substrate with a common wiring in another one of the display panels adjacent to the external-connection terminals, wherein the connection wirings are formed in a conductive layer superior in corrosion resistance to the most inferior corrosion-resistance conductive layer among conductive layers constituting the array substrate.