Array Substrate Dielectric Film for Short Circuit Prevention
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Solution Overview
Problem
In the production of thin film transistor liquid crystal displays (TFT-LCDs), foreign matters deposited during the film layer process can cause short circuits between the signal lines and electrodes due to the large equipment chamber, leading to signal interference and reduced yield and increased power consumption.
Innovation Solution
An array substrate is designed with a dielectric film located between the signal line and the insulating layer, and optionally between the electrode and the insulating layer, which covers the signal line and electrode respectively, preventing short circuits and reducing parasitic capacitance by increasing the distance between these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If film layers are deposited on substrates in a large equipment chamber, then the manufacturing process can be completed, but foreign matters are easily deposited causing short circuits between signal lines and electrodes
Solution Approach 1:
An insulating layer is introduced as an intermediary between the signal line and the electrode. This insulating layer prevents direct contact between the two conductive elements, thereby eliminating the short circuit problem caused by foreign matter deposition during the film layering process.
Solution Approach 2:
The space between the signal line and electrode is segmented into multiple layers: the signal line layer, the insulating layer, and the electrode layer. This segmentation ensures that even if foreign matters are deposited during manufacturing, they cannot cause direct short circuits between the signal line and electrode.
2Use of energy by moving object
If the distance between signal line and electrode is increased to reduce parasitic capacitance, then power consumption is reduced, but the device structure becomes more complex
Solution Approach 1:
Instead of increasing the horizontal distance between the signal line and electrode, the solution moves to the vertical dimension by stacking the insulating layer between them. This dimensional transition reduces parasitic capacitance and power consumption without significantly increasing lateral device complexity.
Solution Approach 2:
A thin film insulating layer is used to separate the signal line and electrode vertically. This thin film approach effectively reduces parasitic capacitance and power consumption while maintaining a compact device structure without requiring large lateral spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric film effectively prevents short circuits and reduces power consumption by minimizing parasitic capacitance, thereby improving product yield and reducing power consumption.
Implementation Method 1
reduces the power consumption of the product at the same time... the dielectric film effectively prevents short circuits and reduces power consumption by minimizing parasitic capacitance
Implementation Method 2
an insulating layer located between the signal line and the electrode... a dielectric film located between the signal line and the insulating layer
Data Source
AI summary
The present disclosure provides an array substrate, a manufacturing method thereof and a display device. The array substrate comprises a base substrate; a signal line and an electrode arranged in different layers on the base substrate, and an insulating layer located between the signal line and the electrode. The array substrate further comprises a dielectric film located between the signal line and the insulating layer, the dielectric film covering the signal line; and/or a dielectric film located between the electrode and the insulating layer, the dielectric film covering the electrode.