Array Substrate Electrode Protection Patterns for Oxidation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In display technology, the use of low resistance metals like copper in electrode patterns leads to oxidation, increasing contact resistances and affecting the yield of display devices due to high connection resistances between electrode patterns.
Innovation Solution
An array substrate design featuring electrode protection patterns made of molybdenum-niobium alloy or titanium, which coat and extend over copper or copper alloy electrode patterns, preventing oxidation and reducing contact resistances by forming an active layer between these patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper or copper alloy is used for electrode patterns to achieve low resistance, then electrical conductivity is improved, but oxidation occurs on the metal surface leading to increased contact resistance
Solution Approach 1:
A protection pattern made of molybdenum-niobium alloy or titanium is introduced as an intermediary layer between the copper electrode pattern and the environment. This protection pattern prevents direct contact between oxygen and the copper surface, thereby eliminating the oxidation problem while maintaining the low resistance characteristic of copper electrodes.
Solution Approach 2:
The electrode structure is transformed from a single-material copper pattern to a composite structure consisting of copper electrode pattern combined with a protection pattern layer. This composite structure combines the low resistance property of copper with the oxidation resistance property of molybdenum-niobium alloy or titanium, resolving the contradiction between conductivity and oxidation resistance.
2Ease of manufacture
If copper electrode patterns are exposed during active layer formation by etching, then manufacturing process is simplified, but contact resistance increases due to oxidation over time
Solution Approach 1:
The protection pattern is formed in advance before the active layer formation process. By pre-establishing this protective barrier, the copper electrode patterns are shielded from oxidation during subsequent manufacturing steps, allowing the etching process to proceed without causing oxidation-related contact resistance issues.
Solution Approach 2:
The protection pattern serves as a mediator that allows the manufacturing process to proceed while protecting the copper electrodes. It enables simplified processing without compromising the electrical contact quality, as the intermediary layer prevents oxidation even when electrodes are exposed during fabrication.
3Object-affected harmful factors
If oxidation layer thickness increases over time, then natural protection occurs, but connection resistance between active layer and electrode patterns becomes excessively high
Solution Approach 1:
Instead of allowing harmful oxidation to occur naturally on copper surfaces, the invention converts this approach by deliberately applying a controlled protection pattern layer. This layer provides the necessary protection against oxidation without forming high-resistance oxide layers, thus converting the potential harm of oxidation into a beneficial protective function with controlled electrical properties.
Solution Approach 2:
The solution changes the parameter of protection mechanism from uncontrolled natural oxidation to controlled artificial protection. By using molybdenum-niobium alloy or titanium with specific thickness and properties, the protection layer provides oxidation resistance while maintaining low contact resistance, fundamentally changing how protection is achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces connection resistances between electrode patterns, improving the yield and performance of display devices by preventing oxidation and diffusion of copper, thus enhancing the manufacturing process.
Implementation Method 1
the surface of the metal is prone to be oxidated when an active layer connecting the source electrode and the drain electrode is formed by etching
Implementation Method 2
a first electrode protection pattern coating the first electrode pattern, and a second electrode protection pattern coating the second electrode pattern
Data Source
AI summary
Embodiments of the present disclosure provide an array substrate and a manufacturing method thereof, and a display device. The array substrate includes a base substrate, a first electrode pattern, a second electrode pattern, and an active layer pattern disposed on the base substrate, a first electrode protection pattern coating the first electrode pattern, and a second electrode protection pattern coating the second electrode pattern. The active layer pattern is disposed between the first electrode pattern and the second electrode pattern. The first electrode protection pattern and the second electrode protection pattern are connected to two sides of the active layer pattern, respectively. The problem that, the active layer pattern cannot be connected to the first electrode pattern and the second electrode pattern due to the surface oxidation, when the first electrode pattern and the second electrode pattern adopt material with low resistance characteristic, is avoided, thus increasing the product yield.