Array Substrate Connection Electrode Resistance Reduction
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Solution Overview
Problem
Display and lighting substrates face challenges in providing a high current supply to light emitting devices like Micro LEDs while maintaining high-density array element arrangements, especially when resolution demands are high, due to resistance issues in existing connection electrode designs.
Innovation Solution
The array substrate incorporates a first connection electrode with a larger area than the first electrode, made of a metal material, and an organic insulation layer to reduce resistance and facilitate higher current transmission, along with a second connection electrode in the same layer, both electrically connected to the light emitting device through via holes, ensuring efficient signal transmission and high-density arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a conventional connection electrode design is used, then the array element arrangement can be dense, but the resistance is high and current supply is insufficient
Solution Approach 1:
The patent introduces a multi-layer electrode structure where the first connection electrode is positioned in a different layer from the first electrode, creating a three-dimensional conductive path. This dimensional transition allows the connection electrode to bypass the planar density constraints, providing a lower resistance path for current while maintaining the high-density arrangement of array elements on the substrate.
Solution Approach 2:
The patent combines multiple electrodes from different layers to form an integrated conductive system. The first electrode in the first layer and the first connection electrode in the second layer are electrically connected through via holes, creating a merged conductive path that leverages both layers to reduce overall resistance and increase current supply capability.
2Quantity of substance
If the connection electrode area is increased to reduce resistance, then current supply improves, but the area occupied by electrodes increases
Solution Approach 1:
By transitioning to a multi-layer structure, the patent allows the connection electrode to extend in the vertical dimension rather than requiring excessive horizontal area. The first connection electrode can have sufficient cross-sectional area for low resistance while being confined to a compact footprint on the substrate, as its conductive path utilizes the third dimension through via hole connections.
Solution Approach 2:
The patent applies different electrode configurations to different regions: the first electrode maintains a compact design for high-density array element arrangement, while the first connection electrode in the second layer provides the necessary cross-sectional area for low resistance current flow. This local differentiation allows each electrode to optimize its function without compromising the other.
3Manufacturing precision
If high-density thin film transistor arrangement is implemented, then display resolution improves, but current transmission capability deteriorates
Solution Approach 1:
The patent resolves the conflict between high-density transistor arrangement and current transmission by moving the current-carrying connection electrode to a second layer above the transistor layer. This vertical separation allows the transistor array to maintain high density in the planar view while the connection electrode provides robust current transmission capabilities in the vertical dimension through via hole connections.
Solution Approach 2:
The patent segments the electrode function into two distinct components: the first electrode in the first layer maintains close proximity to array elements for high-density arrangement, while the first connection electrode in the second layer is optimized for current transmission with sufficient cross-sectional area. This functional segmentation allows each component to specialize in its primary role without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces resistance and increases current supply to light emitting devices, meeting high current demands while enabling high-density thin film transistor and light emitting device arrangements, thus enhancing display resolution and performance.
Implementation Method 1
the first insulation layer is made from an organic insulation material
Data Source
AI summary
An array substrate and a fabrication method thereof, and an electronic apparatus are disclosed. The array substrate includes a base substrate, a thin film transistor, a first connection electrode and a first insulation layer. The thin film transistor is on the base substrate and including a first electrode and a second electrode; the first connection electrode in a layer different from the first electrode and electrically connected with the first electrode; and the first insulation layer covering at least a portion of the first connection electrode; an area of an orthographic projection of the first connection electrode on the base substrate is larger than an area of an orthographic projection of the first electrode on the base substrate, and the first insulation layer is made from an organic insulation material.