Array Substrate Electrostatic Dispersion for Static Damage Prevention
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Solution Overview
Problem
During the manufacturing process of array substrates, static electricity generated by friction between the substrate and transfer mechanisms can lead to electrostatic discharge damage, as the induced electric field exceeds the dielectric strength of insulating media, causing breakdown and leakage currents.
Innovation Solution
Incorporating electrostatic dispersion structures, such as dispersion lines or rings, at the ends of scan lines to increase the electrostatic distribution area and reduce charge density, combined with electrical connection to shift registers through a second metal layer for effective static discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the substrate is transferred using a transfer mechanism during manufacturing, then the substrate can be positioned and processed, but static electricity is generated by friction between the substrate and transfer mechanism
Solution Approach 1:
The patent introduces electrostatic dispersion structures (electrostatic dispersion lines and rings) that convert the harmful static electricity generated during substrate transfer into a beneficial effect by providing a controlled discharge path. These structures allow the accumulated static charge to be safely dissipated through predetermined conductive paths, transforming the harmful electrostatic discharge risk into a controlled electrical phenomenon that protects the scan lines and underlying circuits.
2Reliability
If static electricity accumulates on the substrate, then the electric field generated by induction electrification exceeds the dielectric strength of insulating media, but adding electrostatic dispersion structures increases device complexity
Solution Approach 1:
The patent applies electrostatic dispersion structures selectively at specific locations where static electricity accumulation is most problematic - namely at the ends of scan lines and in the peripheral circuit area. Rather than uniformly distributing complex protection structures across the entire substrate, the solution locally targets high-risk areas with simplified dispersion elements, maintaining scan line integrity while reducing overall device complexity.
Solution Approach 2:
The electrostatic dispersion system is segmented into discrete, modular elements including electrostatic dispersion lines and electrostatic dispersion rings that can be independently configured. These segmented structures are distributed at strategic locations rather than forming a continuous complex network, allowing the system to achieve comprehensive electrostatic protection through multiple simple units rather than one complex structure.
3Object-affected harmful factors
If electrostatic dispersion structures are added to scan lines, then the electrostatic distribution area increases and charge density reduces, but the manufacturing process becomes more complex
Solution Approach 1:
The electrostatic dispersion structures are merged with the existing scan line structure and peripheral circuit elements. The electrostatic dispersion lines are integrated alongside scan lines, and the dispersion rings are positioned to work in conjunction with existing circuit components. This merging approach allows the electrostatic protection function to be added without requiring completely separate manufacturing processes, as the structures can be formed using similar semiconductor fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of insulating medium breakdown and enhances the anti-electrostatic damage ability of the display panel, preventing damage to electronic elements and improving the manufacturing process.
Implementation Method 1
the substrate will have static electricity caused by the friction between the back face of the substrate and the transfer mechanism during the transfer process. The static electricity causes induction electrification to a line on the front face of the substrate.
Implementation Method 2
Electrostatic discharge damage occurs when an electric field generated by the induction electrification on the line exceeds the dielectric strength of an insulating medium.
Data Source
AI summary
Disclosed are an array substrate, display panel and display device. The array substrate includes: a substrate, where the substrate includes a display area and a peripheral circuit area surrounding the display area; the peripheral circuit area is provided with a gate drive circuit; the gate drive circuit includes a group of shift registers connected in cascade; a first metal layer; a second metal layer; scan lines and connection structures corresponding to the scan lines one-to-one; where the first metal layer includes the scan lines; the second metal layer includes the connection structures; the shift registers include scan signal output ends; the scan signal output ends are electrically connected to the scan lines one-to-one through the connection structures; at least one end of at least one scan line is provided with an electrostatic dispersion structure; the electrostatic dispersion structure includes an electrostatic dispersion line or an first electrostatic dispersion ring.