Semiconductor/Solid-State Device Details TRIZ Cases
- Bond Pad Moisture Barrier Structure for Polyimide Wicking
A trench between polyimide layers and a moisture-impervious topcoat block moisture wicking to bond pads, preventing metal migration and shorts.
- Semiconductor Package Layout With Embedded Passives and Low Warpage
Embedded passive devices and stacked molding layers shorten routing paths, improve high-frequency performance, and reduce package warpage.
- Elliptical Redistribution Pad Layout for CTE-Stressed Fan-Out Packages
Oblong or elliptical redistribution pads cut polymer stress from CTE mismatch in fan-out packages, improving yield and reliability.
- Stacked Power Converter Packaging for Bootstrap Diode Integration
A stacked lead-frame package integrates a regular silicon bootstrap diode above the die to cut volume, simplify processing, and improve isolation.
- IC Package Lid Retention for Thermal Interface Metal Reflow
A retaining structure contains thermal interface metal during lid bonding, preventing overflow, voids, and shorting in IC packages.
- Sequential CFET Wafer Bonding With Backside Power Rails
Backside power rails bonded before active-device formation enable stacked CFET tiers with lower parasitic resistance and denser 3D wiring.
- Packaging Substrate Wire Removal for Defect Rework and Reuse
Automated shear cutting and substrate shaking remove defective package wires without damage, enabling substrate reuse and lower rework waste.
- Power Semiconductor Module Assembly With Variable-Height Spacers
Variable-height spacers keep connection layers uniform in power semiconductor modules despite thermal expansion mismatch and base plate deformation.
- Two-Pack Thermal Interface Composition for Vibration-Stable Cooling
A curable two-pack thermal interface material balances coating flow, anti-dropping behavior, and vibration reliability for electronic cooling.
- Interconnect Via Etching with Capping Layer for Vertical Profiles
A capping layer and staged etch sequence produce vertical interconnect vias, reducing leakage and unwanted contact with metal lines.
- Power Semiconductor Moisture Barrier Coating for Reflow Reliability
A conformal moisture barrier on plastic overmold blocks moisture ingress, extending pre-reflow exposure time and reducing package cracking.
- Integrated Circuit Via Randomization for Stable Chip Individualization
Randomly degraded vias create a unique chip fingerprint that stays stable over time and resists environmental drift and cloning.
- Pd-Coated Cu Bonding Wire for High-Humidity Ball Bond Reliability
Indium-alloyed Cu wire with a controlled Pd coating limits interface diffusion and corrosion, extending ball bond life in hot, humid use.
- Interconnect Sidewall Spacer Structure for Via Misalignment Isolation
A dielectric sidewall spacer protects ILD during via and trench misalignment, preserving isolation margins and reducing short-circuit risk.
- Thermally Conductive Insulating Sheet for Leak-Free Surface Conformity
Controlled resin viscosity lets the sheet fill surface irregularities, cut voids, and prevent leakage during heat-press bonding.
- Conformal Chip Edge Sealing for Hermetic IC Protection
A conformal sealing layer wraps IC chip edges to replace area-hungry seal rings, improving moisture protection and dicing robustness.
- Embedded Electronic Module Adhesion Layer for High-Voltage Reliability
An adhesion promoter layer improves encapsulant bonding in embedded electronic modules, reducing delamination and supporting higher-voltage operation.
- Semiconductor Package Routing Via With Dual-Side Seed-Barrier Coverage
Dual-side sputtering builds a composite seed-barrier layer in high-aspect-ratio through holes to improve via coverage and limit diffusion.
- Power FET Island Fuse Layout for Fast Defect Isolation
Breakable fuse areas and passivation isolate defective transistor islands in one step, cutting manufacturing time and leakage currents.
- 3D Memory Dummy Plug Layout to Prevent Word Line Bridging
A dummy plug confined to the upper stack avoids lower-hole metal residue, preventing word line bridging and improving 3D memory yield.
- Composite Heat Dissipation Structure for Daytime Radiative Cooling
Polar dielectric units scatter sunlight and boost thermal emission, enabling daytime heat dissipation with low thermal resistance and durability.
- Through-Electrode Chip Structure for Stacked Package Power and Heat Flow
A rear connection electrode joins paired through electrodes to support stacked-chip power delivery, heat dissipation, and process margin.
- 3D Shared Data Bus Using Stacked IC Interconnect Layers
Stacked IC dies share top interconnect layers for power, clock, and data buses, cutting routing length, capacitive load, and layer count.
- Backside TSV Interconnect Structure for Higher-Density 3D ICs
By thinning the substrate to expose TSVs and forming backside conductive layers, this case enables denser 3D IC interconnects without large carrier substrates.
- Nested Interposer Packaging With Self-Aligned Bump Pads
Bump-pad self-alignment in a nested interposer package improves multi-die yield and reliability while reducing form factor and warpage.
- Laser Substrate Bonding and Peripheral Removal Without Powder
Laser-formed reformed and joining layers enable bonded substrate transfer while removing peripheral portions without powder or overpolishing.
- Oblique Stepped Active Area Layout for Uniform Memory Cell Patterns
Oblique stepped active area patterns align with bit and word line pitches to keep spacing uniform in dense memory cell layouts.
- PCB Through-Hole Layout for Void-Free Resin-Filled Chargers
Through holes in a charger PCB let resin flow through tight spaces, vent air pockets, and improve heat dissipation in compact modules.
- Chip-to-Substrate Solder Assembly Using Pre-Cooldown Underfill
Underfill dispensed before cooldown helps sub-55 μm chip-to-substrate solder joints resist thermal strain, shear stress, and misalignment.
- SiC Chip Protective Structure for Organic Film Peeling Resistance
An inorganic projecting structure improves organic film adhesion on SiC chips, suppressing peeling in hot, humid conditions.
- Molded Interconnect Memory Package with Through-Mold Via Routing
Through-mold vias and molded interconnects shorten memory-to-processor paths, reducing package size while preserving signal integrity.
- 3D Semiconductor Package Layout Without Through-Substrate Vias
Through-encapsulant vias beside stacked dies replace through-substrate vias, cutting packaging complexity and cost while preserving fine-pitch connections.
- Trench Transistor Body Implant Layout for Wire Bond VGSTH Stability
Localized corner implants and deeper body doping under bond pads reduce wire bonding stress and keep transistor threshold voltage uniform.
- Metal Via and Line Layout With Vertical Isolation Spacing
An added insulating layer vertically separates metal vias and lines, reducing short risk while easing scaled interconnect formation.
- Power Module Cooling Structure With Guide-Wall Turbulent Flow
Perpendicular coolant spraying through fins and guide-wall channels boosts power module heat dissipation while limiting flow loss.
- Die Pad Metal Film Layout for Chip Bonding and Heat Dissipation
A partial metal film on the die pad center reduces paste peeling and oxidation while preserving chip bonding strength and heat dissipation.