Thermal Pad with Interlock Structure for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
The miniaturization of semiconductor packages for communication devices leads to increased power consumption and heat generation, which can result in premature failure and reliability issues if not adequately dissipated, and poses challenges in integrating effective thermal dissipation solutions without compromising mechanical reliability.
Innovation Solution
A thermal pad with a heat conductive body and a smaller interlock structure is used to secure the semiconductor die to the substrate, allowing for efficient heat dissipation while maintaining mechanical integrity, featuring a corrugated interlock structure and etch stop layers to prevent material loss during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal pad size is increased to improve heat dissipation, then heat dissipation efficiency is improved, but the package size increases violating miniaturization requirements
Solution Approach 1:
The thermal pad is segmented into two distinct functional regions: a large heat conductive body for efficient heat dissipation and a small interlock structure for mechanical attachment. This segmentation allows the heat dissipation function to be decoupled from the attachment function, enabling effective heat sinking without requiring a large overall pad area that would increase package size.
Solution Approach 2:
Different regions of the thermal pad are assigned different functional qualities: the heat conductive body is optimized for thermal conduction with high thermal conductivity material and large cross-sectional area, while the interlock structure is optimized for mechanical bonding with smaller size and interdigitated geometry. This local differentiation of properties enables simultaneous optimization of heat dissipation and miniaturization.
2Temperature
If a large thermal pad is used for heat dissipation, then heat dissipation efficiency is improved, but mechanical interlock strength deteriorates due to reduced attachment area
Solution Approach 1:
The thermal pad is divided into a large heat conductive body and a separate small interlock structure. This segmentation allows the heat conductive body to be optimized for thermal performance with large area, while the interlock structure is independently optimized for mechanical strength with interdigitated fingers that provide strong bonding without requiring large overall area.
Solution Approach 2:
The interlock structure uses a three-dimensional interdigitated finger design that extends vertically and horizontally, creating multiple bonding interfaces. This dimensional approach allows strong mechanical interlock to be achieved in a compact footprint, decoupling mechanical strength requirements from overall pad area.
3Area of stationary object
If the interlock structure size is reduced to enable miniaturization, then package size is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The thermal pad is segmented into a large heat conductive body for heat dissipation and a small interlock structure for attachment. This segmentation ensures that reducing the interlock structure size for miniaturization does not compromise the heat dissipation efficiency, as the heat conductive body maintains its large area and high thermal conductivity properties independently of the interlock structure dimensions.
4Device complexity
If attachment methods are simplified for miniaturization, then manufacturing complexity is reduced, but reliability deteriorates due to poor thermal and mechanical bonding
Solution Approach 1:
The thermal conduction function and mechanical attachment function are merged into a single integrated thermal pad structure. This eliminates the need for separate thermal interface materials and attachment components, simplifying the manufacturing process while ensuring reliable thermal and mechanical bonding through the unified structure's direct contact with both the semiconductor device and substrate.
Solution Approach 2:
The thermal pad employs composite material construction with high thermal conductivity materials in the heat conductive body and optimized material properties in the interlock structure. This composite approach enables simultaneous achievement of excellent thermal performance and reliable mechanical bonding without requiring complex multi-component assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from the semiconductor die without compromising the structural integrity of the substrate, enhancing the reliability and longevity of the semiconductor package by ensuring strong mechanical interlock and efficient heat flow.
Implementation Method 1
The thermal pad 120 may be made from copper or aluminum or other thermally conductive materials. The heat conductive body 122 of the thermal pad 120 may be extending through the substrate 110 so as to dissipate the heat generated on one side 112 of the substrate 110 to an opposite side 114 of the substrate 110.
Data Source
AI summary
A semiconductor package having a substrate, a thermal pad, and a semiconductor die is disclosed. The thermal pad may have a heat conductive body extending through the substrate. The semiconductor die may be disposed on the thermal pad and in thermal communication with the thermal pad. The thermal pad of the semiconductor package may also have an interlock structure. The interlock structure may provide a mechanical interlock between the thermal pad and the substrate. In addition, a wireless communication device is also disclosed.